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Volumn 383, Issue , 2002, Pages
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Materials science forum: Nitrides and oxynitrides 2
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
ALUMINUM NITRIDE;
CREEP;
CRYSTALLIZATION;
ELASTIC MODULI;
FRACTURE TOUGHNESS;
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
HIGH TEMPERATURE TESTING;
METALLOGRAPHIC MICROSTRUCTURE;
NUCLEATION;
SILICON CARBIDE;
SILICON NITRIDE;
SPECIFIC HEAT;
THERMAL DIFFUSION;
THERMAL EFFECTS;
CARBOTHERMAL REDUCTION;
COMPRESSIVE CREEP;
EIREV;
ENGINEERING CERAMICS;
GRAIN MORPHOLOGY;
LAYERED COMPOSITES;
METAL CATIONS;
NITRIDATION;
OXYNITRIDE GLASSES;
THERMOMECHANICAL STABILITY;
CERAMIC MATERIALS;
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EID: 84963590971
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: None Document Type: Conference Review |
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Times cited : (3)
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References (0)
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