Investigation of the roles of the additive components for second generation copper electroplating chemistries used for advanced interconnect metalization

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 117-119

  Mikkola, R D ^a,b   Chen, Linlin ^c  

^a SEMATECH   (United States)

^b MOTOROLA INC   (United States)

^c Semitool Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CHLORINE COMPOUNDS; COPPER; ELECTROCHEMICAL SENSORS; ORGANIC POLYMERS; POLYMERS; REDUCTION;

BOTTOM-UP FILL; CHLORIDE ION CONCENTRATION; COPPER ELECTROCHEMICAL DEPOSITIONS; COPPER ELECTROPLATING; ELECTROPLATED COPPER; ORGANIC DISULFIDE; SECOND GENERATION; TWO-COMPONENT;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962856807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854299     Document Type: Conference Paper

References (3)

1. J. Healy, D. Pletcher, M. Goodenough, "The chemistry of additives in the bath on open circuit", Part II, J.Electroanal. Chem, 338 (1992), pp. 167-177
2. D. Stoychev and C. Tsvetanov, "Behavior of poly(ethylene glycol) during electrodeposition of bright copper coatings in sulfuric acid electrolytes", J. App. ElectroChem., 26 (1996), pp. 741-749.
3. L. Chen, T. Ritzdorf, L. Graham and D. Fulton, "Advanced Metallization Conference in 1998 (AMC1998), pp. 111.