Effect of W-plug via on electromigration lifetime of metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 149-151

  Guo, Q ^a   Lo, K F ^a   Manna, I ^a   Lim, S ^a   Zeng, X ^a   Cai, J ^a  

^a CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; METALS;

BAMBOO STRUCTURES; CIRCUIT DESIGNS; HIGH RESOLUTION; METAL INTERCONNECTS; MULTIPLE VIAS; RESISTANCE DEGRADATION; RESISTANCE MEASUREMENT; W-PLUG VIAS;

TUNGSTEN;

EID: 84962828465     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854308     Document Type: Conference Paper

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