Copper-SiOC-AirGap integration in a double level metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 276-277

  Demolliens, O ^a   Morand, Y ^b   Fayolle, M ^a   Cochet, M ^a   Assous, M ^a   Feldis, H ^b   Lonis, D ^a   Royer, J C ^a   Gobil, Y ^a   Passemard, G ^b   Maury, P ^b   Jourdan, F ^a   Cordeau, M ^a   Morel, T ^a   Perroud, L ^a   Ulmer, L ^a   Lugard, J F ^b   Renaud, D ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ENGINEERING;

AIR-GAPS; CU/SIO2; DOUBLE LEVEL METALS; INTERCONNECT SCHEMES;

COPPER;

EID: 84962822304     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854347     Document Type: Conference Paper

References (3)

1. P. Gilbert and al, IEDM Tech. Digest, 1998, p1013
2. O. Demolliens and al, IITC, 1999, p198
3. E. Todd Ryan and al, IITC, 1999; p187