메뉴 건너뛰기




Volumn , Issue , 2002, Pages 567-572

An upper bound for 3D slicing floorplans

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; COMPUTER AIDED DESIGN; THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84962222175     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2002.994982     Document Type: Conference Paper
Times cited : (14)

References (25)
  • 1
    • 0035309202 scopus 로고    scopus 로고
    • Stochastic Interconnect Modeling, Power Trends, and Performance Characterization of 3-D Circuits
    • R. Zhang, K. Roy, C.K. Koh, D.B. Janes, "Stochastic Interconnect Modeling, Power Trends, and Performance Characterization of 3-D Circuits", IEEE Transactions on Electron Devices, Vol. 48, No.4, 2001, pp. 638-652.
    • (2001) IEEE Transactions on Electron Devices , vol.48 , Issue.4 , pp. 638-652
    • Zhang, R.1    Roy, K.2    Koh, C.K.3    Janes, D.B.4
  • 4
    • 33747566850 scopus 로고    scopus 로고
    • 3D-ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systemson-Chip Integration
    • K. Banerjee, S.J. Souri, P. Kapur, K.C. Saraswat, "3D-ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systemson-Chip Integration", Proceedings of the IEEE, Vol. 89, No.5, 2001, pp. 602-633.
    • (2001) Proceedings of the IEEE , vol.89 , Issue.5 , pp. 602-633
    • Banerjee, K.1    Souri, S.J.2    Kapur, P.3    Saraswat, K.C.4
  • 11
    • 0031622866 scopus 로고    scopus 로고
    • A Three-Dimensional FPGA with an Integrated Memory for In-Application Reconfiguration Data
    • S. Chiricescu, M. Vai, "A Three-Dimensional FPGA with an Integrated Memory for In-Application Reconfiguration Data", International Symposium on Circuits and Systems 1998, Vol.2, pp. 232-235.
    • International Symposium on Circuits and Systems 1998 , vol.2 , pp. 232-235
    • Chiricescu, S.1    Vai, M.2
  • 13
    • 0031270573 scopus 로고    scopus 로고
    • Three Dimensional Metallization for Vertically Integrated Circuits
    • P. Ramm et. al., "Three Dimensional Metallization for Vertically Integrated Circuits", Microelectronic Engineering 37/38 (1997), pp. 39-47.
    • (1997) Microelectronic Engineering , vol.37-38 , pp. 39-47
    • Ramm, P.1
  • 17
    • 0032163137 scopus 로고    scopus 로고
    • High-Performance Germanium-Seeded Laterally Crystallized TFT's for Vertical Device Integration
    • V. Subramanian, K.C. Saraswat, "High-Performance Germanium-Seeded Laterally Crystallized TFT's for Vertical Device Integration", IEEE Transactions on Electron Devices, Vol 45, No. 9, 1998, pp. 1934-1939
    • (1998) IEEE Transactions on Electron Devices , vol.45 , Issue.9 , pp. 1934-1939
    • Subramanian, V.1    Saraswat, K.C.2
  • 19
    • 0034452632 scopus 로고    scopus 로고
    • Full Chip Thermal Analysis of Planar (2-D) and Vertically Integrated (3-D) High Performance ICs
    • Techn. Digest
    • S. Im, K. Banerjee, "Full Chip Thermal Analysis of Planar (2-D) and Vertically Integrated (3-D) High Performance ICs", International Electron Devices Meeting 2000, Techn. Digest, pp.727-730.
    • International Electron Devices Meeting 2000 , pp. 727-730
    • Im, S.1    Banerjee, K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.