Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study

IEEE International Conference on Industrial Engineering and Engineering Management

Volumn 2016-January, Issue , 2016, Pages 1427-1431

  Chong, K E ^a   Ng, K C ^b   Goh, G G G ^c  

^a UNIVERSITI TEKNIKAL MALAYSIA MELAKA   (Malaysia)

^b Infineon Technologies Malaysia Sdn Bhd   (Malaysia)

^c MULTIMEDIA UNIVERSITY   (Malaysia)

Author keywords

FMEA methodology; maintenance FMEA; Overall Equipment Effectiveness (OEE); Total productive maintenance

Indexed keywords

COMPETITION; FAILURE (MECHANICAL); MAINTENANCE; PRODUCTIVITY; QUALITY CONTROL; QUALITY MANAGEMENT; SEMICONDUCTOR DEVICE MANUFACTURE;

FAILURE MODE AND EFFECT ANALYSIS; FMEA METHODOLOGY; OVERALL EQUIPMENT EFFECTIVENESS; PRODUCTIVITY IMPROVEMENTS; SEMICONDUCTOR MANUFACTURERS; SEMICONDUCTOR MANUFACTURING; TOTAL PRODUCTIVE MAINTENANCE; WORLD CLASS MANUFACTURING;

ENGINEERING EDUCATION;

EID: 84962019530     PISSN: 21573611     EISSN: 2157362X     Source Type: Conference Proceeding    
DOI: 10.1109/IEEM.2015.7385883     Document Type: Conference Paper

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