Stopper-less hybrid low-k/Cu DD structure fabrication combined with low-k CMP

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 250-252

  Usami, T ^a   Nanbu, H ^a   Sugai, K ^a   Tagami, M ^a   Miyamoto, H ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ENGINEERING;

DUAL DAMASCENE; ETCHING SELECTIVITY; HYBRID STRUCTURE; INORGANIC LOW-K; METAL RESIDUES; MULTI-LAYERED STRUCTURE; PLANARIZATION; STRUCTURE FABRICATION;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84961757618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014948     Document Type: Conference Paper

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