Cross-sectional elastic imaging and defect detection in low-k spin-on dielectrics

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 239-241

  Muthuswami, L ^a   Moyer, E S ^b   Li, Z ^b   Geer, R E ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b DOW CORNING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DEPTH PROFILING; SILICON; SILICON OXIDES; ULTRASONIC APPLICATIONS;

CHARACTERIZATION TECHNIQUES; DEFECT DETECTION; DEPTH DEPENDENTS; ELASTIC IMAGING; MECHANICAL DEFECTS; NANOMECHANICAL; SPIN ON DIELECTRICS; ULTRASONIC FORCE MICROSCOPY;

LOW-K DIELECTRIC;

EID: 84961711983     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014945     Document Type: Conference Paper

References (4)

1. The International Technology Roadmap for Semiconductors Semiconductor Industry Association, San Jose, CA, 1999.
2. Q. Han, E. S. Moyer, et al., Proceedings of the International Interconnect Technology Conference. p. 171 (2001).
3. Shekhawat, G.S.; Kolosov, O.V.; Briggs, G.A.D.; Schaffer, E.O.; Martin, S.; Geer, R.E., Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics. Symposium (Materials Research Society Symposium Proceedings Vol.612) p. 1 (2001).
4. T.Kramer et al, Sens. & Act. A (2001).