Integration challenges of 0.1 μm CMOS Cu/low-k interconnects

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 9-11

  Yu, K C ^a   Werking, J ^a   Prindle, C ^a   Kiene, M ^a   Ng, M F ^a   Wilson, B ^a   Singhal, A ^a   Stephens, T ^a   Huang, F ^a   Sparks, T ^a   Aminpur, M ^a   Linville, J ^a   Denning, D ^a   Brennan, B ^a   Shahvandi, I ^a   Wang, C ^a   Flake, J ^a   Chowdhury, R ^a   Svedberg, L ^a   Solomentsev, Y ^a   Kim, S ^a   Cooper, K ^a   Usmani, S ^a   Smith, D ^a   Olivares, M ^a   Carter, R ^a   Eggenstein, B ^a   Strozewski, K ^a   Junker, K ^a   Goldberg, C ^a   Filipiak, S ^a   Martin, J ^a   Grove, N ^a   Ramani, N ^a   Ryan, T ^a   Mueller, J ^a   Guvenilir, A ^a   Zhang, D ^a   Ventzek, P ^a   Wang, V ^a   Lii, T ^a   King, C ^a   Crabtree, P ^a   Farkas, J ^a   Iacoponi, J ^a   Pellerin, J ^a   Melnick, B ^a   Woo, M ^a   Weitzman, E ^a   more..

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; LOW-K DIELECTRIC;

CMOS TECHNOLOGY; CU-INTERCONNECTS; CU/LOW-K INTERCONNECTS; HIGH ASPECT RATIO; HIGH YIELD; MULTILEVELS; PROCESS IMPROVEMENT; TEST VEHICLE;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84961711396     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014870     Document Type: Conference Paper

References (6)

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5. J. Wetzel, et al. IEDM, 2001.
6. S.M. Rossnagel and H. Kim, IITC, 2001.