Production worthy repeatability of spike anneals

Proceedings of the International Conference on Ion Implantation Technology

Volumn 22-27-September-2002, Issue , 2002, Pages 83-86

  Paul, S ^a   Bayha, B ^a   Lerch, W ^a   Merkl, C ^a   Downey, D F ^b   Arevalo, E A ^b  

^a MATTSON THERMAL PRODUCTS GMBH   (United States)

^b VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES   (United States)

Author keywords

component; flash annealing spike annealing; RTA; ultra shallow junction

Indexed keywords

ANNEALING; DATA HANDLING; ELECTRIC RESISTANCE; ION IMPLANTATION; NANOTECHNOLOGY; RAPID THERMAL ANNEALING; RAPID THERMAL PROCESSING; SHEET RESISTANCE; SILICON WAFERS;

COMPONENT; EQUIPMENT MANUFACTURERS; INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS; PRE-AMORPHIZATION; SOURCE/DRAIN EXTENSION; SOURCE/DRAIN SERIES RESISTANCES; SPIKE ANNEALING; ULTRA SHALLOW JUNCTION;

SEMICONDUCTOR JUNCTIONS;

EID: 84961355875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IIT.2002.1257944     Document Type: Conference Paper

References (7)

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4. W. Lerch, B. Bayha, D. F. Downey, E. A. Arevalo, "State of the art techniques for ultra-shallow junction formation", Electrochemical Society Proceedings Volume 2001-9
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6. T. Gutt, "Pre-Recipe Optimization", Technical Notice 29, 1998
7. B. Murto, "Recent Advances and Continuing Challenges in Ultra-Shallow Junctions", Proc. of Third National Implant Users Meeting, Oct. 1999