Adaptation of neural network and application of digital ultrasonic image processing for the pattern recognition of defects in semiconductor

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 274-279

  Kim, Jae Yeol ^a   Jeong, Hyun Jo ^a   Kim, Hun Cho ^a   Kim, Chang Hyun ^a  

^a Chosun University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BACKPROPAGATION; BACKPROPAGATION ALGORITHMS; CHIP SCALE PACKAGES; CONFORMAL MAPPING; CRACKS; DEFECTS; DELAMINATION; EDGE DETECTION; FAILURE (MECHANICAL); IMAGE ACQUISITION; MODIFIED ATMOSPHERE PACKAGING; NEURAL NETWORKS; PACKAGING MATERIALS; PATTERN RECOGNITION; SELF ORGANIZING MAPS; SEMICONDUCTOR DEVICES; ULTRASONIC APPLICATIONS; ULTRASONIC IMAGING;

BACK PROPAGATION NEURAL NETWORKS; DEFECTS IN SEMICONDUCTORS; MULTI LAYER PERCEPTRON; PATTERN RECOGNITION ALGORITHMS; PATTERN RECOGNITION TECHNIQUES; PATTERN RECOGNITION TECHNOLOGIES; PRE-PROCESSING METHOD; REDUCTION OF DIMENSIONALITY;

IMAGE PROCESSING;

EID: 84960426041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983997     Document Type: Conference Paper

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