Design considerations for manufacturability of MEMS comb actuators

Proceedings of the ASME Design Engineering Technical Conference

Volumn 1, Issue , 1996, Pages

  Dixit, Hrishikesh ^a   Taylor, Dean L ^a   Kannapan, Srikanth ^b  

^a Cornell University   (United States)

^b Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTROMECHANICAL DEVICES; ETCHING; INTEGRATED CIRCUITS; MEMS; PARAMETRIC DEVICES; SILICON WAFERS;

DESIGN CONSIDERATIONS; ELECTROSTATIC DRIVE; INTEGRATED CIRCUIT FABRICATION; KNOWLEDGE ORGANIZATION; MICRO ELECTROMECHANICAL SYSTEM (MEMS); PARAMETRIC DESIGN SPACE; RELIABILITY CONSTRAINTS; STRUCTURED ORGANIZATION;

ELECTROSTATIC ACTUATORS;

EID: 84958973535     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/96-DETC/DFM-1311     Document Type: Conference Paper

References (7)

1. Prasad, R., MacDonald, N.C and Taylor D.L. 1995, "Micro- Instrumentation for Tribological Measurements", Proceedings of the 7th International Conference on Solid-State Sensors and Actuators (Transducers '95), Stockholm, Sweden.
2. Shaw, K.A., Zhang, Z.L.and MacDonald, N.C. 1993, "SCREAM I: A Single-mask, Single-crystal Silicon Process for Micro-electromechanical Structures", IEEE MEMS '93, Fort Lauderdale, Florida, USA, pp. 155-163.
3. Tang W.C., Nguyen T.H., Judy M.W. and Howe T.T. 1990, "Electrostatic Comb Drive of Lateral Polysilicon Resonators", Sensors and Actuators, A21-A23, pp.328-331.
4. Prasad, R. 1995, "Investigation of Friction in Microelectromechanical Systems", Ph.D. Thesis, Cornell University.
5. Saif, M.T.A. and N.C.MacDonald 1995, "Deformation of Large MEMS due to Thermal and Intrinsic Stresses", SPIE Vol. 2441, pp. 329-340.
6. Shi F. 1995 "Simulation and Analysis of Micro-electromechanical Systems (MEMS) with Application of Sensitivity Analysis and Optimization", Ph.D. Thesis, Cornell University, pp. 38-67.
7. Kannapan, S. M. and Marshek, K. M. 1992, "A Schema for Negotiation between Intelligent Design Agents in Concurrent Engineering", In Intelligent Computer-Aided Design, Elsevier Science Publishers B.V. (North Holland), pp. 1-19.