Optimization of preparation conditions for melamine urea formaldehyde based adhesive for plywood application using response surface methodology

Indian Journal of Chemical Technology

Volumn 23, Issue 1, 2016, Pages 39-46

  Ong, Huei Ruey ^a   Reddy Prasad, D M ^b   Khan, Md Maksudur Rahman ^a  

^a UNIVERSITY MALAYSIA PAHANG   (Malaysia)

^b FACULTY OF ENGINEERING   (Brunei Darussalam)

Author keywords

Filler; Melamine urea formaldehyde resin; Palm kernel meal; Wood adhesive

Indexed keywords

EID: 84958960387     PISSN: 0971457X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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