Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

European Solid-State Circuits Conference

Volumn 2015-October, Issue , 2015, Pages 156-159

  Settaluri, Krishna T ^a   Lin, Sen ^a   Moazeni, Sajjad ^a   Timurdogan, Erman ^b   Sun, Chen ^a,b   Moresco, Michele ^b   Su, Zhan ^b   Chen, Yu Hsin ^b   Leake, Gerald ^c   Latulipe, Douglas ^c   McDonough, Colin ^c   Hebding, Jeremiah ^c   Coolbaugh, Douglas ^c   Watts, Michael ^b   Stojanović, Vladimir ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^c SUNY POLYTECHNIC INSTITUTE   (United States)

Author keywords

3D integration; heterogeneous; link; optics; transceivers

Indexed keywords

CAPACITANCE; ENERGY UTILIZATION; OPTICAL FIBERS; OPTICS; RECONFIGURABLE HARDWARE; THREE DIMENSIONAL INTEGRATED CIRCUITS; TRANSCEIVERS;

3-D INTEGRATION; DEVELOPMENT PLATFORM; HETEROGENEOUS; HETEROGENEOUS PLATFORMS; INTEGRATED ELECTRONICS; LINK; ON-CHIP CALIBRATIONS; SINGLE-MODE OPTICAL FIBER;

WAFER BONDING;

EID: 84958779490     PISSN: 19308833     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSCIRC.2015.7313852     Document Type: Conference Paper

References (6)

1. J. Muldavin, et al., "SOI for MEMS and advanced packaging," IEEE International SOI Conference, October 2012.
2. E. Timurdogan, et al. "An Ultra Low Power 3D Integrated Intra-Chip Silicon Electronic-Photonic Link," [Post-deadline] Optical Fiber Communication Conference, Los Angeles, CA, 3 pages, March 2015.
3. F. Y. Liu, et al., "10-Gbps, 5.3-mW Optical Transmitter and Receiver Circuits in 40-nm CMOS", IEEE JSSC, vol. 47, no. 9, pp. 2049-2067, September 2012.
4. E. Timurdogan, et al., "An ultra-low power athermal silicon modulator", Nature Comm., vol. 5, no. 4008, pp. 1-11, June 2014.
5. C. Li, et al., "A ring-resonator-based silicon photonics transceiver with bias-based wavelength stabilization and adaptive-power-sensitivity receiver", IEEE ISSCC, pp.124,125, 2013.
6. A. Huang, et al., "A 10Gb/s photonic modulator and WDM MUX/DEMUX integrated with electronics in 0.13μm SOI CMOS," IEEE ISSCC pp.922,929, Feb. 2006