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Volumn 1304, Issue , 1997, Pages 69-78

Thermal monitoring on FPGAs using ring-oscillators

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Indexed keywords


EID: 84957869701     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: 10.1007/3-540-63465-7_212     Document Type: Conference Paper
Times cited : (47)

References (11)
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    • IEEE Press
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    • (1991) Proc. 1991 EURO ASIC Conf , pp. 334-338
    • Quenot, G.1    Paris, N.2    Zavidovique, B.3
  • 5
    • 84957930243 scopus 로고    scopus 로고
    • Design for thermal testability (DfTT) and CMOS realization, submitted to
    • Special Issue on Therminic Workshop
    • V. Szekely, Cs. Marta, M. Rencz, Z. Benedek and B. Courtois, “Design for thermal testability (DfTT) and CMOS realization”, submitted to Sensors and Actuators, Special Issue on Therminic Workshop.
    • Sensors and Actuators
    • Szekely, V.1    Marta, C.S.2    Rencz, M.3    Benedek, Z.4    Courtois, B.5
  • 6
    • 33847222880 scopus 로고    scopus 로고
    • Sense PCB Thermal Equilibrium
    • March 18
    • W. Sjursen, “Sense PCB Thermal Equilibrium”, Electronic Design, pp.115-116, March 18, 1996.
    • (1996) Electronic Design , pp. 115-116
    • Sjursen, W.1
  • 7
    • 84957865650 scopus 로고    scopus 로고
    • Dynamic Thermal Testing of Integrated Circuits
    • Barcelona: Universitat Politecnica de Catalunya
    • Altet, J. and Rubio, A., “Dynamic Thermal Testing of Integrated Circuits”, Proc. DCIS’96, pp.537-541, Barcelona: Universitat Politecnica de Catalunya, 1996.
    • (1996) Proc. DCIS’96 , pp. 537-541
    • Altet, J.1    Rubio, A.2
  • 8
    • 0343524096 scopus 로고
    • April
    • Xilinx Inc., “Xact Libraries Guide”, pp. 3-388, April 1994.
    • (1994) Xact Libraries Guide , pp. 3-388
  • 9
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    • Get Maximum Accuracy from Temperature Sensors
    • August
    • Steele, J., “Get Maximum Accuracy from Temperature Sensors”, Electronic Design, pp. 99-110, August, 1996.
    • (1996) Electronic Design , pp. 99-110
    • Steele, J.1
  • 11
    • 84957930245 scopus 로고    scopus 로고
    • Trading Off Among the Three Ps: Power, Package & Performance
    • Xilinx Inc., “Trading Off Among the Three Ps: Power, Package & Performance”, XCELL, N° 22, 1996.
    • (1996) XCELL , Issue.22


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.