Mechanical Behavior and Electromagnetic Interference Shielding Properties of C/SiC-Ti3Si(Al)C2

Journal of the American Ceramic Society

Volumn 99, Issue 5, 2016, Pages 1717-1724

  Fan, Xiaomeng ^a,b   Yin, Xiaowei ^a   Chen, Lingqi ^a   Zhang, Litong ^a   Cheng, Laifei ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; ELECTRIC CONDUCTIVITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; FRACTURE TOUGHNESS; FUNCTIONAL MATERIALS; MAGNETIC SHIELDING; SHIELDING; SIGNAL INTERFERENCE; SILICON; SILICON ALLOYS; SILICON CARBIDE; TEMPERATURE;

EFFECTIVE VOLUME; ELECTRICAL CONDUCTIVITY; ELECTROMAGNETIC INTERFERENCE SHIELDING; EMI SHIELDING EFFECTIVENESS; LOW TEMPERATURE DENSIFICATION; MECHANICAL BEHAVIOR; MICRO DEFORMATION MECHANISM; SHIELDING PROPERTIES;

ALUMINUM;

EID: 84957824085     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/jace.14124     Document Type: Article

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