Detection and imaging of subsurface microcracks in silicon wafers using photoacoustic microscope

Japanese Journal of Applied Physics

Volumn 31, Issue , 1992, Pages 146-148

  Nakata, Toshihiko ^a   Kembo, Yukio ^a   Kitamori, Takehiko ^b   Sa Wada, Tsuguo ^b  

^a HITACHI LTD   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Modulation frequency response; Photoacoustic effect; Photoacoustic microscopy; Piezoelectric transducer; Silicon wafer; Subsurface crack; Thermal impedance; Thermoelastic wave velocity

Indexed keywords

EID: 84957269583     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAPS.31S1.146     Document Type: Article

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