Adapting to noisy 3D data - attenuating the acquisition footprint

SEG Technical Program Expanded Abstracts

Volumn 19, Issue 1, 2000, Pages 9-12

  Drummond, J M ^a   Budd, Arthur J L ^b   Ryan, James W ^b  

^a ANADARKO PETROLEUM CORPORATION   (United States)

^b Target Finders Limited   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84955146061     PISSN: 10523812     EISSN: 19494645     Source Type: Conference Proceeding    
DOI: 10.1190/1.1816247     Document Type: Conference Paper

References (10)

1. Budd, A. J. L., Hawkins, K., Mackewn, A. R., and Ryan, J.W., 1995, Marine geometry design for optimum 3D seismic imaging: Presented at the 57th EAEG Conference and Technical Exhibition.
2. Gonzales and Woods, 1993, Digital Image Processing, published by Addison-Wesley Inc.
3. Gulunay N, Martin, F., and Martinez, R., 1994, 3D Data acquisition artifacts removal by spot editing in the spatial-temporal frequency domain: Presented at the 56th EAEG Conference and Technical Exhibition.
4. Hampson, G., 1994, Relationships between wavefield sampling and coherent noise attenuation: Presented at the 56th EAEG Conference and Technical Exhibition.
5. Hampson, G., 1998, 3D wavefield sampling in the CMP method: Presented at the 60th EAGE Conference and Technical Exhibition.
6. Jacubowicz, H, 1994, Wavefield Reconstruction: Presented at the 56th EAEG Conference and Technical Exhibition.
7. Kerner, K., 1990, Modelling of soft sediments and liquid-solid interfaces: Modified wavenumber summation method and application, Geophysical Prospecting, 38, 111-138.
8. Marfurt, K., Scheet, R. M., Sharp, J. A., Cain, G. J., and Harper, M. G., 1995, Suppression of the acquisition footprint for seismic sequence attribute mapping: Presented at the 65th Ann. Internat. Mtg., Soc. Expl. Geophys.
9. Vermeer, G., 1990, Seismic Wavefield Sampling: Geophysical References, Volume 4.
10. Walker, C. D. T., Mackewn, A. R., Budd, A. J. L. and Ryan, J. W., 1995, Marine 3D geometry design for optimum acquisition system response: Presented at the 57th EAEG Conference and Technical Exhibition.