A new abrasive-free, chemical-mechanical-polishing technique for aluminum metallization of ULSI devices

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 1992-December, Issue , 1992, Pages 976-978

  Hayashi, Y ^a   Kikuta, K ^a   Kikkawa, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRON DEVICES; METALLIZING; POLISHING; SILICA; ULSI CIRCUITS;

ALUMINUM (AL); ALUMINUM METALLIZATION; POLISHING SELECTIVITY; POLISHING TECHNIQUES; SIO2 FILM; ULSI DEVICES;

CHEMICAL MECHANICAL POLISHING;

EID: 84955051353     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1992.307520     Document Type: Conference Paper

References (2)

1. C. Yu, et. al., IEEE 1991 VMIC Conf., Proc., p199.
2. S. Roeh1, et. al., IEEE 1992 VMIC Conf., Proc., p22.