Measurement of water evaporation rate from epoxy

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 440-443

  Chong, Iok Tong ^a   Lam, David C C ^a   Tong, Pin ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DELAMINATION; DIGITAL STORAGE; ELECTRONICS PACKAGING; EVAPORATION; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SOLDERING; STEAM;

ANALYTICAL METHODOLOGY; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; INTERFACIAL DEFECT; INTERFACIAL DELAMINATION; MATERIAL SELECTION; ORDERS OF MAGNITUDE; STEAM SATURATIONS;

PACKAGING;

EID: 84954508838     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904196     Document Type: Conference Paper

References (3)

1. Jones, Frank E, "Evaporation of water: with emphasis on applications and measurement," Chelsen, Mich, Lewis Publishers (1992)
2. J. Crank, The mathematics of diffusion, 2nd edn. Clarendon Press, Oxford, pp. 44-68, 1975
3. J.M. Vergnaud, Drying of Polymeric and Solid Materials, Springer-Verlag (1992)