Electroless deposition processes: Fundamentals and applications

Advances in Electrochemical Science and Engineering

Volumn 3, Issue , 2008, Pages 55-116

  Okinaka, Yutaka ^b   Osaka, Tetsuya ^a  

^a WASEDA UNIVERSITY   (Japan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

INDUSTRIAL ENGINEERING;

ELECTROLESS DEPOSITION PROCESS;

ENGINEERING;

EID: 84953864603     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527616770.ch2     Document Type: Chapter

References (207)

1. A. Brenner, G. E. Riddell, J. Res. Nat'l Bur. Std. 37, 31 (1946); ibid., 39, 385 (1947).
2. Electroless Plating - Fundamentals and Applications, G. O. Mallory and J. B. Haydu (eds.), American Electroplaters and Surface Finishers Society, Orlando (1990).
3. M. Saito, J. Met. Finish. Soc. Jpn 16, 300 (1965); ibid., 17, 14 (1966); 17, 258 (1966); ibid., 17, 264 (1966).
4. M. Paunovic, Plating 55, 1161 (1968).
5. I. Ohno, O. Wakabayashi, S. Haruyama, J. Electrochem. Soc. 132, 2323 (1985).
6. T. Osaka, H. Takematsu, K. Nihei, J. Electrochem. Soc. 127, 1021 (1980).
7. T. Yoshida, T. Osaka, Memoirs Sch. Sci. Eng., Waseda Univ. 44, 41 (1980).
8. T. Osaka, K. Nihei, F. Goto, Denki Kagaku 50, 418 (1982).
9. J. E. A. M. van den Meerakker, J. Appl. Electrochem. 11, 395 (1981).
10. A. Vashkyalis, Elektrokhimiya 14, 1770 (1978).
11. F. L. Shippey, F. M. Donahue, Plating 60, 43 (1973).
12. A. Molenaar, M. F. E. Holdrinet, L. K. H. Van Beek, Plating 61, 238 (1974).
13. G. O. Mallory, V. Lloyd, Plating Surface Finish., 72 (9), 65 (1985).
14. F. M. Donahue, F. L. Shippey, Plating 60, 135 (1973).
15. F. M. Donahue, J. Electrochem. Soc. 119, 72 (1972).
16. I. Ohno, S. Haruyama, Surface Technol. 13, 1 (1981)
17. I. Ohno, Mat. Sci. Eng. A146, 33, (1991).
18. S. Haruyama, Proc. 5th Int. Congr. on Metallic Corrosion, Houston, Texas (1974), p. 82.
19. I. Epelboin, M. Keddam, H. Takenouchi, J. Appl. Electrochem. 2, 71 (1972).
20. I. Ohno, T. Tsuru, S. Haruyama, Proc. 10th International Congress of Metal Finishing (Inter-finish '80), Kyoto, Jpn., 152 (1980).
21. M. Suzuki, K. Kanno, O. Sakai, Y. Sato, Proc. 10th International Congress of Metal Finishing (Interfinish '80), Kyoto, Jpn., 157 (1980).
22. M. Suzuki, N. Sato, K. Kanno, Y. Sato, J. Electrochem. Soc. 129, 2183 (1982).
23. N. Sato, M. Suzuki, Y. Sato, J. Electrochem. Soc. 130, 1485 (1983).
24. T. Osaka, I. Koiwa, J. Metal Finish. Soc. Jpn. 34, 330 (1983).
25. Y. Shimizu, S. Ishibashi, J. Metal Finish. Soc, Jpn. (Kinzoku Hyomen Gijutsu) 19, 418 (1968).
26. T. Osaka, M. Usuda, I. Koiwa, H. Sawai, Jpn. J. Appl. Phys. 27 (10), 1885 (1988).
27. K. Nihei, T. Osaka, H. Sawai, Denki Kagaku 44, 402 (1976).
28. T. Osaka, K. Arai, N. Masubuchi, J. Metal Finish. Soc. Jpn. 39, 778 (1988).
29. F. Pearlstein, R. F. Weightman, R. Wick, Metal Finish. 61 (11), 77 (1963).
30. F. Pearlstein, R. F. Weightman, Electrochem. Technol. 6, 427 (1968).
31. T. Osaka, H. Sawai, F. Otoi, K. Nihei, J. Metal Finish. Soc. Jpn. 31, 661 (1980).
32. T. Osaka, H. Sawai, N. Kasai, J. Metal Finish Soc. Jpn. 32, 615 (1981).
33. I. Koiwa, T. Osaka, H. Sawai, J. Metal Finish. Soc. Jpn. 34, 600 (1983).
34. H. Sawai, T. Kanamori, S. Shibata, K. Nihei, T. Osaka, I. Koiwa, M. Nishikawa, Proc. 11th International Congress of Metal finishing Interfinish '84), Jerusalem, Israel (1984), p. 323.
35. I. Koiwa, M. Usuda, T. Osaka, J. Electrochem. Soc. 135, 1222 (1988).
36. T. Osaka, M. Fukawa, J. Kawaguchi, Denki Kagaku 56, 60 (1988).
37. T. Osaka, M. Fukawa, J. Kawaguchi, Denki Kagaku 60, 523 (1992).
38. T. Osaka, M. Fukawa, S. Ueda, J. Kawaguchi, Proc. 13th International Congress of Metal Finishing (Interfinish '92), Sao Paulo, Brazil (1992).
39. G. O. Mallory, Plat. Surface Finish., 63 (6), 34 (1976).
40. M. Schwartz, G. O. Mallory, J. Electrochem. Soc. 123, 606 (1976).
41. G. O. Mallory, T. R. Hohn, Plating Surface Finish., 66 (4), 40 (1979).
42. I. Koiwa, M. Nishikawa, K. Yamada, T. Osaka, Bull. Chem. Soc. Jpn. 59, 133 (1986).
43. I. Koiwa, K. Yamada, M. Usuda, T. Osaka, Denki Kagaku 54, 514 (1986).
44. I. Koiwa, M. Usuda, K. Yamada, T. Osaka, J. Electrochem. Soc 135, 718 (1988).
45. T. Osaka, K. Arai, Y. Yamazaki, T. Namikawa, Jpn. J. Appl. Phys. 28 (2), 229 (1989).
46. T. Osaka, H. Yamazaki, I. Saito, J. Electrochem. Soc. 136, 3418 (1989).
47. T. Osaka, K. Arai, N. Masubuchi, H. Sawai, J. Surface Finish. Soc. Jpn. (Hyomen Gijutsu) 41, 45 (1990).
48. T. Osaka, N. Masubuchi, K. Arai, Y. Okuno, J. Surface Finish. Soc. Jpn. 41, 49 (1990).
49. T. Matsuda, U. Mizutani, in: Proc. 4th Int. Conf. Rapidly Quenched Metals, T. Masumoto and K. Suzuki (ed.), Jpn. (1982), Vol. 2, p. 1315.
50. R. D. Fisher, W. H. Chilton, J. Electrochem. Soc. 109, 485 (1962).
51. L. D. Ranson, V. Zentner, J. Electrochem. Soc. 111, 1423 (1964).
52. Y. Moradzadeh, J. Electrochem. Soc. 112, 891 (1965).
53. D. E. Speriotis, J. R. Morrison, J. S. Judge, IEEE Trans. Magn., MAG-1, 348 (1965).
54. J. S. Judge, J. R. Morrison, D. E. Speriotis, G. Bate, J. Electrochem. Soc. 112, 681 (1965).
55. D. E. Speliotis, J. S. Judge, J. R. Morrison, J. Appl. Phys. 37, 1158 (1966).
56. M. G. Miksic, R. Travieso, A. Arcus, R. H. Wright, J. Electrochem. Soc 113, 360 (1966).
57. J. S. Judge, J. R. Morrison, D. E. Speriotis, J. Electrochem. Soc. 113, 547 (1966).
58. J. R. DePew, J. Electrochem. Soc. 120, 1187 (1973).
59. R. D. Fisher, D. E. Koopman, J. Electrochem. Soc 111, 263 (1964).
60. A. S. Frieze, R. Sard, R. Weil, J. Electrochem. Soc. 115, 586 (1968).
61. V. Morton, R. D. Fisher, J. Electrochem. Soc. 116, 188 (1969).
62. S. L. Chow, N. E. Hedgecock, M. Schlesinger, J. Electrochem. Soc 119, 1614 (1972).
63. F. Pearlstein, R. F. Weightman, Plating 54, 714 (1967).
64. F. Pearlstein, R. F. Weightman, J. Electrochem. Soc 121, 1023 (1974).
65. I. Tsu, Plating 48, 379 (1961); J. Electrochem. Soc. 48, 1207 (1961).
66. J. S. Sallo, J. M. Carr, J. Electrochem. Soc. 109, 1040 (1962).
67. G. V. Elmore, P. Bakos, J. Electrochem. Soc 111, 1244 (1964).
68. G. Bate, D. E. Speliotis, J. Appl. Phys. 34, 1073 (1964).
69. S. Iwasaki, K. Yasuda, A. Senda, IECEJ Tech. Rep. MR65-17 (1965).
70. R. Sard, C. D. Schwartz, R. Weil, J. Electrochem. Soc. 113, 424 (1966).
71. S. Iwasaki, K. Ouchi, K. Yasuda, IECEJ Tech. Rep. MR66-18 (1966).
72. J. H. Kefalas, J. Appl. Phys. 37, 1160 (1966).
73. S. Hattori, A. Tago, Y. Ishii, A. Terada, O. Ishii, S. Ohta, Elec. Comm. Lab. Tech. J., 31, 277 (1982).
74. Y. Sato, A. Terada, S. Ohta, T. Miyamoto, NTT Elec. Comm. Lab. Tech. J. 36, 485 (1987).
75. F. Goto, Y. Suganuma, T. Osaka, J. Metal Finish. Soc. Jpn. 33, 414 (1982).
76. R. D. Fisher, IEEE Trans. Magn. MAG-2, 681 (1966).
77. H. Matsuda, O. Takano, J. Jpn. Inst. Met. 52, 414 (1988).
78. F. Goto, M. Kimura, N. Shiota, T. Yamamoto, M. Yanagisawa, Autmn Natl. Conv. Rec., IEICEJ, 5-164 (1989).
79. H. Nagasaka, T. Michimori, H. Takeno, J. Surface Finish. Soc. Jpn. 42, 58 (1991).
80. T. Osaka, H. Nagasaka, J. Electrochem. Soc 128, 1686 (1981).
81. M. Mirzamaani, L. T. Romankiw, C. McGrath, J. Mahlke, N. C. Anderson, J. Electrochem. Soc. 135, 2813 (1988).
82. D. DiMilia, J. Horkans, C. McGrath, M. Mirzamaani, G. Scilla, J. Electrochem. Soc. 135, 2817 (1988).
83. H. Matsubara, M. Toda, T. Sakuma, T. Homma, T. Osaka, Y. Yamazaki, T. Namikawa, J. Electrochem. Soc. 136, 753 (1989).
84. S. Iwasaki, Y. Nakamura, IEEE Trans Magn. MAG.-13, 1272 (1977).
85. J. Hokkyo, F. Kugiya, J. Magn. Soc. Jpn. 13 (SI), 1 (1989).
86. Y. Nakamura, S. Iwasaki, IEEE Trans. Magn. MAG-20, 105 (1984).
87. S. Yamamoto, Y. Nakamura, S. Iwasaki, IEEE Trans. Magn. MAG-23, 2070 (1987).
88. M. Sato, Y Hoshino, Denki Kagaku 35, 111 (1967).
89. S. Kawai, R. Ueda J. Electrochem. Soc. 122, 32 (1975).
90. S. Kawai, J. Electrochem. Soc. 122, 1026 (1975).
91. S. Kawai, I. Ishiguro, J. Electrochem. Soc. 123, 1047 (1975).
92. T. Chen, P. Cavallotti, IEEE Trans. Magn. MAG-18, 1125 (1982).
93. J. Horkans, D. J. Seagle, I-C. H. Chang, J. Electrochem. Soc. 137, 2056 (1990).
94. T. Osaka, F. Goto, N. Kasai, Y. Suganuma, Denki Kagaku 49, 792 (1981).
95. T. Osaka, N. Kasai, J. Metal Finish. Soc. Jpn. 32, 309 (1981).
96. F. Goto, T. Osaka, N. Kasai, I. Koiwa, H. Tanaka, M. Aoyama, Y. Suganuma, Proc Symp. on Inst. Elec. Comn., Tohoku Univ. 197 (1982).
97. T. Osaka, G. Goto, N. Kasai, I. Koiwa, Y. Suganuma, J. Electrochem. Soc. 130, 568 (1983).
98. T. Osaka, N. Kasai, I. Koiwa, F. Goto, J. Electrochem. Soc. 130, 790 (1983).
99. I. Koiwa, Y. Okabe, H. Matsubara, T. Osaka, F. Goto, J. Magn. Soc Jpn. 9, 83 (1985); translated into English in IEEE Translation J. Magn. Jpn, TJMJ-1, 443 (1985).
100. I. Koiwa, M. Toda, T. Osaka, J. Electrochem. Soc 133, 597 (1986).
101. I. Koiwa, H. Matsubara, T. Osaka, Y. Yamazaki, T. Namikawa, J. Electrochem. Soc. 133, 685 (1986).
102. T. Osaka, I. Koiwa, M. Toda, T. Sakuma, Y. Yamazaki, T. Namikawa, J. Magn. Soc. Jpn. 10, 5 (1986); translated into English in IEEE Translation J. Magn. Jpn. TJMJ-2, 208 (1987).
103. T. Osaka, I. Koiwa, M. Toda, T. Sakuma, Y. Yamazaki, T. Namikawa, F. Goto, IEEE Trans. Magn. MAG-22, 1149 (1986).
104. I. Koiwa, T. Osaka, Y. Yamazaki, T. Namikawa, IEEE Trans. Magn. MAG-23, 2800 (1987).
105. T. Osaka, H. Matsubara, T. Sakuma, T. Homma, S. Yokoyama, Y. Yamazaki, T. Namikawa, J. Magn. Soc Jpn. 12, 77 (1988); translated into English in IEEE Translation J. Magn. Jpn TJMJ-4, 39 (1989).
106. O. Takano, H. Matsuda, H. Izumitani, K. Ito, J. Metal Finish. Soc Jpn. 35, 440 (1984).
107. H. Matsuda, O. Takano, J. Metal Finish. Soc Jpn. 37, 753 (1986).
108. T. Osaka, H. Matsubara, K. Yamanishi, H. Mizutani, F. Goto, IEEE Trans. Magn. MAG-23, 2356 (1987).
109. H. Matsubara, S. Mitamura, K. Nöda, T. Osaka, F. Goto, J. Magn. Soc. Jpn. 13, 153 (1989); translated into English in IEEE Translation J. Magn. Jpn TJMJ-5, 276 (1990).
110. H. Matsubara, K. Yamanishi, H. Mizutani, T. Osaka, J. Metal Finish. Soc. Jpn. 37, 708 (1986).
111. T. Homma, K. Saito, T. Osaka, J. Surface Finish. Soc. Jpn. 40, 140 (1989).
112. T. Homma, K. Saito, T. Osaka, Jpn. J. Appl. Phys. 29, 1701 (1990).
113. T. Osaka, T. Homma, K. Saito, K. Nöda, F. Goto, N. Shiota, T. Yamamoto, IEICEJ Techn. Rep. MR90-10 (1990).
114. T. Osaka, T. Homma, K. Inoue, K. Saga, Denki Kagaku 58, 661 (1990).
115. T. Homma, K. Inoue, H. Asai, K. Ohrui, T. Osaka, Y. Yamazaki, T. Namikawa, J. Magn. Soc. Jpn. 15 (2), 113 (1991).
116. T. Osaka, T. Homma, J. Surface Finish. Soc. Jpn. 42, 283 (1991).
117. L. T. Romankiw, I. M. Croll, N. Hatzakis, IEEE Trans. Mag. MAG-6, 597 (1970).
118. D. A. Thompson, L. T. Romankiw, IBM Disk Storage Technology (1980), p. 3.
119. J. M. Harker, D. W. Brede, R. E. Pattison, G. R. Santana, L. G. Taft, IBM J. Res. Develop. 25, 677 (1981).
120. S. H. Liao, IEEE Trans. Mag. MAG-23, 2981 (1987).
121. T. Osaka, T. Homma, N. Masubuchi, K. Saito, M. Yoshino, Y. Yamazaki, T. Namikawa, J. Mag. Soc. Jpn. 14 (2), 309 (1990).
122. T. Osaka, T. Homma, K. Saito, A. Takekoshi, J. Electrochem. Soc. 139, 1311 (1992).
123. T. Osaka, T. Homma, C. Tsai, Proc. 59th Spring Meeting of Electrochem. Soc Jpn (1992), p. 88
124. T. Osaka, T. Homma, C. Tsai, M. Takai, K. Kageyama, Denki Kagaku 61, No. 8 (1993)
125. H. Akahoshi, K. Murakami, M. Wajima, S. Kawakubo, IEEE Trans. Comp. Hybrids Manuf. Tech. CHMT-9, No. 2, 181 (1986).
126. M. C. Bennett, N. O. Schmidt, Trans. Faraday Soc. 51, 1412 (1955).
127. Y. Okinaka, Extended Abstract, Electrochemical Soc. Fall Meeting, Detroit (1969).
128. P. Bindra, D. Light, D. Rath, IBM J. Res. Develop. 28, 668 (1984).
129. R. Bieber, G. Trumpler, Helv. Chim. Acta 30, 1860 (1947).
130. R. Schumacher, J. J. Pesek, O. R. Melroy, J. Phys. Chem. 89, 4338 (1985).
131. S. Gottesfeld, J. Beery, M. Paffett, M. Hollander, C. Maggiore, J. Electrochem. Soc 133, 1344 (1986).
132. B. J. Feldmann, O. R. Melroy, J. Electrochem. Soc. 136, 640 (1989).
133. H. Wiese, K. G. Weil, Ber. Bunsenges. Phys. Chem. 91, 619 (1987).
134. Y. Okinaka, S. Nakahara, J. Electrochem. Soc. 123, 475 (1976).
135. S. Nakahara, Y. Okinaka, Acta Metall. 31, 713 (1983).
136. Y. Okinaka, H. K. Straschil, J. Electrochem. Soc. 133, 2608 (1986)
137. J. E. Graebner, Y. Okinaka, J. Appl. Phys. 60 (1), 36 (1986).
138. S. Nakahara, Acta Metall. 36, 1669 (1988).
139. S. Nakahara, Y. Okinaka, H. K. Straschil, J. Electrochem. Soc. 136, 1120 (1989).
140. S. Nakahara, C. Y. Mak, Y. Okinaka, J. Electrochem. Soc. 138, 1421 (1991).
141. S. Nakahara, Y. Okinaka, Annual Rev. Mater. Sci. 21, 93 (1991).
142. J. Grunwald, L. Smolinski, A. Landau, Proc. the Fourth Plating in the Electronics Industry Symp. 13, (1973).
143. H. Honma, S. Mizushima, J. Metal Finish. Soc Jpn. 34, 290 (1983).
144. M. Matsuoka, T. Ito, T. Hayashi, ibid., 33, 385 (1982).
145. S. Nakahara, C. Y. Mak, Y. Okinaka, J. Electrochem. Soc. 110, 533 (1993).
146. S. Mizumoto, H. Nawafune, M. Kawasaki, A. Kinoshita, K. Araki, Plating Surface Finish. 73 (12), 48 (1986).
147. S. Mizumoto, H. Nawafune, M. Kawasaki, J. Surface Finish. Soc Jpn. 39, 301 (1988).
148. S. Mizumoto, H. Nawafune, T. Sonoda, K. Araki, J. Surface Finish. Soc. Jpn. 41, 169 (1990).
149. J. G. Grunwald, D. E. Kukanskis, R. A. Letize, D. A. Sawoska, H. Rhodenizer, Proc. AES Second Electroless Plating Symp. F-1 (1984).
150. A. Hung, Plating Surface Finish. 75 (1), 62 (1988).
151. A. Hung, Plating Surface Finish. 75 (1), 74 (1988).
152. A. Hung, K.-M. Chen, J. Electrochem. Soc. 136, 72 (1989).
153. A. Hung, I. Ohno, Plating Surface Finish. 77 (3), 54 (1990).
154. J. Darken, Printed Circuit World Convention V, Glasgow (June 1990), p. 12.
155. H. Honma, M. Komatsu, T. Fujinami, J. Surface Finish. Soc. Jpn. 42, 913 (1991).
156. Y. Okinaka, Plating 57, 914 (1970).
157. Y. Okinaka, C. Wolowodiuk, Plating 58, 1080 (1971).
158. R. Sard, Y. Okinaka, J. R. Rushton, Plating 58, 893 (1971).
159. Y. Okinaka, J. Electrochem. Soc. 120, 739 (1973).
160. Y. Okinaka, R. Sard, C. Wolowodiuk, W. H. Craft, T. F. Retajczyk, J. Electrochem. Soc. 121, 56 (1974).
161. R. Sard, Y. Okinaka, H. A. Waggener, J. Electrochem. Soc. 121, 62 (1974).
162. J. A. Gardiner, J. W. Collat, J. Am. Chem. Soc. 86, 3165 (1964); ibid., 87, 1692 (1965); Inorg. Chem. 4, 1208 (1965).
163. A. Kasugai, Kokai Tokkyo Koho (Japanese Pat. Disc.) 80-24914 (1980).
164. Y. Takakura, Kokai Tokkyo Koho (Japanese Pat. Disc.) 81-152958 (1981).
165. M. Matsuoka, S. Imanishi, M. Sahara, T. Hayashi, J. Metal Finish. Soc. Jpn. 38, 55 (1987); Plating Surface Finish., 75 (5), 102, (1988).
166. J. D. E. Mclntyre, W. F. Peck, J. Electrochem. Soc 123, 1800 (1976).
167. C. D. Iacovangelo, J. Electrochem. Soc. 138, 976 (1991).
168. C. D. Iacovangelo, K. P. Zarnoch, J. Electrochem. Soc 138, 983 (1991).
169. Y. Okinaka, in: Electroless Plating: Fundamentals and Applications, G. O. Mallory, J. B. Haydu, (eds.), American Electroplaters and Surface Finishers Society (1990), Chap. 15
170. J. Ushio, O. Miyazawa, H. Yokono, A. Tomizawa, Kokai Tokkyo Koho (Japanese Pat. Disc) 87-86171 (1987).
171. J. Ushio, O. Miyazawa, A. Tomizawa, N. Matsuura, H. Yokono, Kokai Tokkyo Koho (Japanese Pat. Disc), 87-247081 (1987).
172. N. Matsuura, O. Miyazawa, A. Tomizawa, J. Ushio, H. Yokono, Kokai Tokkyo Koho (Japanese Pat. Disc.) 87-270779 (1987).
173. O. Miyazawa, J. Ushio, A. Tomizawa, N. Matsuura, H. Yokono, Kokai Tokkyo Koho (Japanese Pat. Disc) 88-79976 (1988).
174. J. Ushio, O. Miyazawa, H. Yokono, A. Tomizawa, European Patent Application EP 021789 (April 29, 1987).
175. J. Ushio, O. Miyazawa, A. Tomizawa, H. Yokono, N. Kanda, N. Matsuura, S. Ando, H. Okuhira, K. Mori, Kokai Tokkyo Koho (Japanese Pat. Disc.) 89-268876 (1989).
176. M. Kato, S. Hoshino, I. Ohno, Kokai Tokkyo Koho (Japanese Pat. Disc.) 89-191782 (1989).
177. M. Kato, K. Niikura, S. Hoshino, I. Ohno, J. Surface Finish. Soc Jpn. 42, 729 (1991).
178. N. Koura, A. Kubota, J. Metal Finish. Soc. Jpn. 36, 182 (1985).
179. F. Pearlstein, Plating 58, 1014 (1971).
180. J. Jostan, W. Mussinger, German Pat. DE 3132679 (1983).
181. A. Molenaar, J. Electrochem. Soc. 129, 1917 (1982).
182. V. P. Pilnikov, USSR Pat. SU985136 (1983).
183. D. Lamouche, P. Clechet, J. R. Martin, E. Haroutiounian, J. P. Sandino, J. Electrochem. Soc. 134, 692 (1987).
184. R. N. Rhoda, Trans. Inst. Metal Finish. 36, 82 (1959).
185. H. Laub, H. Januschkowetz, German Pat. DE2841584 (1980).
186. F. Pearlstein, R. F. Weightman, Plating 56, 10, 1158 (1969).
187. W. V. Hough, J. L. Little, K. V. Warheit, U. S. Patent 4, 255, 194 (1981); 4, 279, 951 (1981).
188. R. N. Roda, R. F. Vines, U. S. Pat. 3, 486, 928 (1969).
189. E. Torikai, K. Takenaka, Y. Kawami, Japanese Pat. 84-80764 (1984).
190. E. Torikai, Y. Kawami, K. Takenaka, Japanese Pat. 84-80766 (1984).
191. V. Strejcek, German Pat. DE2607988 (1977).
192. H. Nishikawa, S. Minami, J. Metal Finish. Soc. Jpn. 33, 114 (1982).
193. A. Senda, Y. Takano, T. Nakagawa, J. Surface Finish. Soc. Jpn. 43, 694 (1992).
194. K. Obata, T. Sanoda, N. Dohi, J. Metal Finish. Soc. Jpn. 33, 375 (1982).
195. A. Molenaar, J. J. C. Coumans, Surface Tech. 16, 265 (1982).
196. A. Molenaar, J. W. G. deBakker, J. Electrochem. Soc 136, 378 (1989).
197. B. G. Slay, B. G. Carbajal, J. Electrochem. Soc. 113, 306 (1966).
198. A. Senda, T. Nakagawa, Y. Takano, T. Kasanami, J. Surface Finish. Soc. Jpn. 43, 324 (1992).
199. H. Koyano, Japanese Pat. 59-211566 (1984).
200. Y. Kouchi, M. Oyamada, T. Hosaka, H. Honma, Proc. 82nd Conference of Surface Finishing Soc. Jpn. 17B-10 (1990).
201. D. L. Rutkevich, G. P. Shevchenko, V. V. Svirido, N. P. Osipovich, J. Electrochem. Soc. 139, 429C (1992).
202. A. Senda, Y. Takano, T. Nakagawa, J. Surface Finish. Soc. Jpn. 44, 145 (1993).
203. A. Senda, Y. Takano, T. Nakagawa, J. Surface Finish. Soc. Jpn. 43, 967 (1992).
204. A. Senda, Y. Takano, T. Nakagawa, J. Surface Finish. Soc. Jpn. 43, 689 (1992).
205. N. Koura, Chap. 17 in Ref. 2 (1990).
206. Y. Okinaka, Chap. 15 in Ref. 2 (1990).
207. Y. Okinaka, C. Wolowodiuk, Chap. 16 in Ref. 2 (1990).