-
1
-
-
33644910141
-
High-efficient integrated electronic ballast for compact fluorescent lamps
-
M. Ponce, A.J. Martinez, J. Correa, M. Cotorogea, J. Arau High-efficient integrated electronic ballast for compact fluorescent lamps IEEE Trans. Power Electron. 21 2006 532e542
-
(2006)
IEEE Trans. Power Electron.
, vol.21
, pp. 532e542
-
-
Ponce, M.1
Martinez, A.J.2
Correa, J.3
Cotorogea, M.4
Arau, J.5
-
2
-
-
0033292686
-
Thermal design of high power semiconductor packages for aircraft systems
-
F. Sarvar, D.C. Whalley Thermal design of high power semiconductor packages for aircraft systems J. Electron. Manuf. 9 1999 269e274
-
(1999)
J. Electron. Manuf.
, vol.9
, pp. 269e274
-
-
Sarvar, F.1
Whalley, D.C.2
-
3
-
-
0038481269
-
Evolution of cooling technology for electrical, electronic, and microelectronic equipment
-
A.E. Bergles Evolution of cooling technology for electrical, electronic, and microelectronic equipment IEEE Trans. Compon. Packag. Technol. 26 2003 6e15
-
(2003)
IEEE Trans. Compon. Packag. Technol.
, vol.26
, pp. 6e15
-
-
Bergles, A.E.1
-
4
-
-
0037408315
-
Developing an equivalent thermal model for discrete semiconductor packages
-
A. Ammous, F. Sellami, K. Ammous, H. Morel, B. Allard, J.P. Chante Developing an equivalent thermal model for discrete semiconductor packages Int. J.Thermal Sci. 42 2003 533e539
-
(2003)
Int. J.Thermal Sci.
, vol.42
, pp. 533e539
-
-
Ammous, A.1
Sellami, F.2
Ammous, K.3
Morel, H.4
Allard, B.5
Chante, J.P.6
-
5
-
-
0343237735
-
Thermal management of high power electronics with phase change cooling
-
T.J. Lu Thermal management of high power electronics with phase change cooling Int. J. Heat Mass Transf. 43 2000 2245e2256
-
(2000)
Int. J. Heat Mass Transf.
, vol.43
, pp. 2245e2256
-
-
Lu, T.J.1
-
6
-
-
0033314362
-
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
-
C.P. Wong, R.S. Bollampally Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging J. Appl. Polym. Sci. 74 14 1999 3396 3403
-
(1999)
J. Appl. Polym. Sci.
, vol.74
, Issue.14
, pp. 3396-3403
-
-
Wong, C.P.1
Bollampally, R.S.2
-
8
-
-
0035546301
-
Thermally conducting aluminum nitride polymermatrix composites
-
Y. Xu, D.D.L. Chung, C. Mroz Thermally conducting aluminum nitride polymermatrix composites Compos. Part A 32 12 2001 1749 1757
-
(2001)
Compos. Part A
, vol.32
, Issue.12
, pp. 1749-1757
-
-
Xu, Y.1
Chung, D.D.L.2
Mroz, C.3
-
9
-
-
84855319432
-
Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material
-
H. Yu, L.L. Li, T. Kido, G.N. Xi, G.C. Xu, F. Guo Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material J. Appl. Polym. Sci. 124 2012 669e677
-
(2012)
J. Appl. Polym. Sci.
, vol.124
, pp. 669e677
-
-
Yu, H.1
Li, L.L.2
Kido, T.3
Xi, G.N.4
Xu, G.C.5
Guo, F.6
-
10
-
-
84862928239
-
The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles
-
S. Choi, H. Im, J. Kim The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles Nanotechnology 23 2012 5303e5312
-
(2012)
Nanotechnology
, vol.23
, pp. 5303e5312
-
-
Choi, S.1
Im, H.2
Kim, J.3
-
11
-
-
24144499437
-
Comparative study of thermally conductive fillers in underfill for the electronic components
-
W.S. Lee, J. Yu Comparative study of thermally conductive fillers in underfill for the electronic components Diam. Relat. Mater. 14 2005 1647e1653
-
(2005)
Diam. Relat. Mater.
, vol.14
, pp. 1647e1653
-
-
Lee, W.S.1
Yu, J.2
-
12
-
-
58049142576
-
Enhanced thermal conductivity in a hybrid graphite nanoplatelet e carbon nanotube filler for epoxy composites
-
A.P. Yu, P. Ramesh, X.B. Sun, E. Bekyarova, M.E. Itkis, R.C. Haddon Enhanced thermal conductivity in a hybrid graphite nanoplatelet e carbon nanotube filler for epoxy composites Adv. Mater. 20 2008 4740e4744
-
(2008)
Adv. Mater.
, vol.20
, pp. 4740e4744
-
-
Yu, A.P.1
Ramesh, P.2
Sun, X.B.3
Bekyarova, E.4
Itkis, M.E.5
Haddon, R.C.6
-
13
-
-
70349680919
-
An electrical method for the measurement of the thermal and electrical conductivity of reduced graphene oxide nanostructures
-
T. Schwamb, B.R. Burg, N.C. Schirmer, D. Poulikakos An electrical method for the measurement of the thermal and electrical conductivity of reduced graphene oxide nanostructures Nanotechnology 20 2009 5704e5709
-
(2009)
Nanotechnology
, vol.20
, pp. 5704e5709
-
-
Schwamb, T.1
Burg, B.R.2
Schirmer, N.C.3
Poulikakos, D.4
-
14
-
-
33646193349
-
Processing of expanded graphite reinforced polymer nanocomposites
-
Asma Yasmin, Jyi-Jiin Luo, Isaac M. Daniel∗ Processing of expanded graphite reinforced polymer nanocomposites Compos. Sci. Technol. 66 2006 1182 1189
-
(2006)
Compos. Sci. Technol.
, vol.66
, pp. 1182-1189
-
-
Yasmin, A.1
Luo, J.-J.2
Daniel, I.M.3
-
15
-
-
84891535420
-
Thermal and mechanical interfacial properties of expanded graphite/epoxy composites
-
S.J. Park, K.S. Kim, J.R. Lee Thermal and mechanical interfacial properties of expanded graphite/epoxy composites J. Korean. Ind. Eng. Chem. 15 2004 493 498
-
(2004)
J. Korean. Ind. Eng. Chem.
, vol.15
, pp. 493-498
-
-
Park, S.J.1
Kim, K.S.2
Lee, J.R.3
-
16
-
-
84858192980
-
Thermolysis and conductivity studies of poly(ethyleneoxide) (PEO) based polymer electrolytes doped with carbon nanotube
-
S. Ibrahim, M.R. Johan Thermolysis and conductivity studies of poly(ethyleneoxide) (PEO) based polymer electrolytes doped with carbon nanotube Int. J.Electrochem. Sci. 7 2012 2596 2615
-
(2012)
Int. J.Electrochem. Sci.
, vol.7
, pp. 2596-2615
-
-
Ibrahim, S.1
Johan, M.R.2
-
18
-
-
58049205757
-
Thermodynamic assessment of B-Zr and Si-Zr binary systems
-
H.M. Chen, F. Zheng, H.S. Liu et al. Thermodynamic assessment of B-Zr and Si-Zr binary systems J. Alloy. Compd. 468 2009 209 216
-
(2009)
J. Alloy. Compd.
, vol.468
, pp. 209-216
-
-
Chen, H.M.1
Zheng, F.2
Liu, H.S.3
-
19
-
-
68249144483
-
Advanced technology for functionalization of carbon nanotubes
-
L. Meng, C. Fu, Q. Lu Advanced technology for functionalization of carbon nanotubes Prog. Nat. Sci. 19 2009 801 810
-
(2009)
Prog. Nat. Sci.
, vol.19
, pp. 801-810
-
-
Meng, L.1
Fu, C.2
Lu, Q.3
|