Relationships among properties of sputtered thin films and sputtering process parameters

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2001-January, Issue , 2001, Pages 42-46

  Kolar M ^a   Mach, P ^a  

^a CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CONCURRENT ENGINEERING; ELECTRONICS PACKAGING; MAGNETRON SPUTTERING; RADIO WAVES; SHEET RESISTANCE; SPUTTERING;

ALUMINUM SILICONS; ARGON ATMOSPHERES; INFLUENCE OF PROCESS PARAMETERS; RADIO FREQUENCY MAGNETRON SPUTTERING; SPUTTERED THIN FILMS; SPUTTERING PROCESS; SPUTTERING TIME; THICKNESS OF THE FILM;

THIN FILMS;

EID: 84952890405     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2001.931006     Document Type: Conference Paper

References (4)

1. MAISSEL, L.: Handbook Of Thin Film Technology, McGraw-Hill Book Company, New York 1970.
2. HOLLAND, L.: Thin Film Microelectronics, Chapman & Hall, London 1968.
3. GOSPODINOVA, M., ARNAUDOV, R., TZVETKOVA, A: Study of parasitics in Multilayer MCM Carriers, Annual School Lectures, Special Issue I, Vol. 20, No. 1, Sofia, Bulgaria, 1998
4. th ISSE, God, Hungary, 1996