Accelerated life time test methods for new package technologies

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2001-January, Issue , 2001, Pages 215-219

  Nemeth P ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

CONCURRENT ENGINEERING;

ACCELERATED TESTS; HIGHLY ACCELERATED STRESS TESTS; PACKAGE TECHNOLOGIES; PACKAGING TECHNOLOGIES; PRESSURE COOKER TEST; PRESSURE COOKERS; RELIABILITY PARAMETERS; TEMPERATURE CYCLING;

ELECTRONICS PACKAGING;

EID: 84952884825     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2001.931061     Document Type: Conference Paper

References (4)

1. th Electronic Components and Technology Conference, Las Vegas, USA, May 21-24, 2000 pp. 1605-1609.
2. Motorola, "Plastic Ball Grid Array, AN-1231", 1996
3. Yoshinori Kin, Yasuko Sasaki: "What is Environmental Testing?", ESPEC Technology Report, No.1, 1996, pp 2-16.
4. Toshio Yamamoto: "Humidity Measurement and Control in the HAST", ESPEC Technology Report, No.5, 1998, pp 11-19.