Electrically conductive polyaniline adhesive

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 118-120

  Pietila M ^a   Makela T ^a   Levon, K ^b   Kivilahti, J ^c   Isotalo, H ^a,d  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b POLYTECHNIC UNIVERSITY   (United States)

^c AALTO UNIVERSITY   (Finland)

^d CENTRE FOR METROLOGY AND ACCREDITATION MIKES   (Finland)

Author keywords

Chemical technology; Conducting materials; Conductive adhesives; Curing; Electrical resistance measurement; Electrodes; Glass; Gold; Semiconductor device measurement; Thermal conductivity

Indexed keywords

ADHESIVES; COATINGS; CONDUCTIVE MATERIALS; CURING; DOPING (ADDITIVES); ELECTRODES; GLASS; GOLD; JOINING; MANUFACTURE; MONOMERS; SEMICONDUCTOR DEVICES; TENSILE STRENGTH; THERMAL CONDUCTIVITY;

CHEMICAL TECHNOLOGIES; CONDUCTING MATERIALS; CONDUCTIVE ADHESIVE; ELECTRICAL RESISTANCE MEASUREMENT; SEMICONDUCTOR DEVICE MEASUREMENTS;

POLYANILINE;

EID: 84952317594     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860584     Document Type: Conference Paper

References (9)

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