Novel low-temperature processing of polymer dielectrics on organic substrates by variable frequency microwave processing

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 254-259

  Tanikella, Ravindra V ^a   Allen, Sue A Bidstrup ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Dielectrics; Organic substrates; Polyimides; Rapid curing; Variable frequency microwave

Indexed keywords

CHARACTERIZATION; CHIP SCALE PACKAGES; CURING; OPTICAL PROPERTIES; PACKAGING MATERIALS; POLYIMIDES; SUBSTRATES; TEMPERATURE; THERMODYNAMIC STABILITY;

DECOMPOSITION TEMPERATURE; ELECTRICAL AND OPTICAL PROPERTIES; ELEVATED TEMPERATURE; LOW TEMPERATURE PROCESSING; ORGANIC SUBSTRATE; RAPID CURING; THERMOMECHANICAL PROPERTIES; VARIABLE FREQUENCY MICROWAVE;

DIELECTRIC MATERIALS;

EID: 84949999333     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990396     Document Type: Conference Paper

References (8)

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5. B. Panchapakesan et al, "Variable Frequency Microwave", Advanced Packaging, p. 60, September / Oct., 1997.
6. Farnsworth K.D., Manepalli R.N., Bidstrup Allen, S. A., and Kohl P. A., Int. J. Microcircuits. Elec. Pckg., 23, pp 162-171 (2000).
7. Kimberley D. Farnsworth, PhD dissertation, Georgia Institute of Technology, 1999.
8. D.A. Lewis et al, "Accelerated Imidization using Microwave Radiation", J. Polym. Sci. Polym. Chem. Ed. Vol. 23, pp 1647-1653, 1992.