Effects of process parameters on the mold adhesion force in IC encapsulation process

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 166-171

  Hwang, Sheng Jye ^a   Lee, Huei Huang ^a   Chuang, Chun Hua ^a   Huang, Duan Yuan ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

EMC; Mold adhesion force; Taguchi's parameter Design

Indexed keywords

ADHESION; ELECTROMAGNETIC COMPATIBILITY; PACKAGING MATERIALS; SURFACE TREATMENT;

ADHESION FORCES; ENCAPSULATION PROCESS; EPOXY MOLDING COMPOUNDS; MOLD CAVITIES; PROCESS PARAMETERS; TAGUCHI'S METHODS; TAGUCHI'S PARAMETER DESIGN; TAGUCHI'S PARAMETER DESIGN METHOD;

MOLDS;

EID: 84949948301     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990381     Document Type: Conference Paper

References (3)

1. Anon, "Standard Test Method for Tensile Properties of Adhesive Bonds," STD. ASTM D897-95a.
2. Anon, "Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading," STD. ASTM D1002-94.
3. Anon, "Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds," STD. ASTM D1062-96.