Application of SU-8 in flip chip bump micromachining for millimeter wave applications

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 204-209

  Wong, A ^a   Linton, D ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

Degradation; Etching; Flip chip; Lithography; Mass production; Micromachining; MMICs; Prototypes; Radio frequency; Resists

Indexed keywords

ASPECT RATIO; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; DEGRADATION; ELECTRONICS PACKAGING; ETCHING; FLIP CHIP DEVICES; LITHOGRAPHY; MICROMACHINING; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PHOTOLITHOGRAPHY; PHOTORESISTS;

FLIP CHIP; MASS PRODUCTION; PROTOTYPES; RADIO FREQUENCIES; RESISTS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84949546084     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906374     Document Type: Conference Paper

References (10)

1. Hargis, B; "Advanced Ceramic Packaging and Multichip Modules", Advancing Microelectronics, March/April 1994, p. 45.
2. Itoh, T; Numerical Techniques for Microwave and Millimeter-Wave Passive Structures, John Wiley and Sons, New York, 1989, pp. 1-33.
3. Flack, W; Fan, W; and White, W; "Optimisation and Characterization of Ultrathick Photoresist Films", Proc. Advances in Resist Technology and Processing XV, Proc. SPIE, Vol. 3333, 1998, pp. 1288-1303.
4. Lorenz, H; Despont, M; Fahrni, N; LaBianca, N; Renaud, P; Vettiger, P; "EPON SU-8 : A Low Cost Negative Resist for MEMS", Micromechanics Europe MME 96, Spain, 1996, pp. 32-35.
5. Gross, M.E; "Considerations for Electroplated Copper for Sub-micron Interconnects in Advanced Integrated Circuits", Proc. AESF SUR/FIN '99 Technical Conference, Jun 21-24, 1999.
6. dos Santos, S.G; Martins, L.F.O; D'Ajello, P.C.T; Pasa, A. A; Hasenack, C.M; "Electroless and Electro-Plating of Cu on Si", Microelectronic Engineering, Vol. 33, No. 1-4, Jan 1997.
7. Forrest, G; "Technologies of High Aspect Ratio Plating", Printed Circuit Fabrication, Vol. 14, No. 7, July 1991, pp. 44-47.
8. Oppermann, H.H; Kallmayer, C; Klein, M; Aschenbrenner, R; Reichl, H; "Advanced Flip Chip Technologies in RF, Microwave and MEMS Applications", Proc. SPIE (International Society for Optical Engineering), Vol. 4019, 2000, pp. 308-314.
9. Yamada, H; Togasaki, T; Tateyama, K; Higuchi, K; "Advanced Copper Column Based Solder Bump for Flip Chip Interconnection", International Journal of Microcircuits and Electronic Packaging, Vol. 21, No. 1, 1998, pp. 15-21.
10. Neely, C; Reynolds, H.V; "Electrolytic Plating of Copper for Emerging Computer Chip Interconnect Technologies : Key Challengs and Opportunities", Proc. AESF Technical Conference, 1999, pp. 129-134.