Nanotechnology circuit design - The "interconnect problem"

Proceedings of the IEEE Conference on Nanotechnology

Volumn 2001-January, Issue , 2001, Pages 123-127

  Goel, Ashok K ^a  

^a Michigan Technological University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; INTEGRATED CIRCUIT MANUFACTURE; NANOTECHNOLOGY;

FIRST-ORDER ANALYSIS; HIGH CURRENT DENSITIES; HIGH-SPEED INTERCONNECTS; INTERCONNECT LINES; INTERCONNECT STRUCTURES; METALLIC INTERCONNECTS; NANOTECHNOLOGY CIRCUITS; NETWORK APPROXIMATION;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84949238235     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2001.966405     Document Type: Conference Paper

References (7)

1. Several excellent references on the emerging nanotechnology issues can be found on the following web sites, among others: http://www.mitre.org/technology/nanotech
2. http://www.sc.doe.gov/production/bes/IWGN.Public.Brochure/welcome.htm
3. http://www.sc.doe.gov/production/bes/NNI.htm
4. http://www.ornl.gov/ment
5. http://www.nsf.gov/home/crssprgm/nano/start.htm
6. A. K. Goel, High-Speed VLSI Interconnections, John Wiley & Sons, New York, 1994.
7. D. F. Frost and K. F. Poole, "A Method for Predicting VLSI-Device Reliability Using Series Models for Failure Mechanisms", IEEE Trans. Reliab., vol. R-36, no. 2, pp. 234-242, 1987.