Probing and wire bonding of aluminum capped copper pads

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2002, Pages 140-143

  Hotchkiss, G ^a   Aronoff, Jason ^a   Broz, Jerry ^a   Hartfield, Cheryl ^a   James, Randy ^a   Stark, Les ^a   Subido, Willmar ^a   Sundararaman, Vish ^a   Test, Howard ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

Aluminum; Assembly; Copper; Fabrication; Integrated circuit interconnections; Integrated circuit reliability; Manufacturing processes; Microelectronics; Wafer bonding; Wire

Indexed keywords

ALUMINUM; ASSEMBLY; COPPER; FABRICATION; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; INTERMETALLICS; MANUFACTURE; MICROELECTRONIC PROCESSING; MICROELECTRONICS; RELIABILITY; SILICON WAFERS; WIRE;

ALUMINUM BOND PADS; COPPER INTERCONNECTS; COPPER WIRE BONDINGS; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT RELIABILITY; MANUFACTURING PROCESS; MICROELECTRONICS MANUFACTURING; WAFER FABRICATIONS;

WAFER BONDING;

EID: 84949222474     PISSN: 15417026     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2002.996626     Document Type: Article

References (4)

1. Tran, T.A. et. al., "Fine Pitch Probing and Wire Bonding Reliability of Aluminum Cap Copper Bond Pads", Proceedings of IEEE Southwest Test Workshop, San Diego, CA, June 11-14, 2000
2. Hotchkiss, G. et. al., "Effects of Probe Damage on Wire Bond Integrity", Proceedings of the 2001 Electronic Components and Technology Conference (ECTC), Orlando, FL, pp. 1175-1180
3. ASTM Standard F1269-89, "Test Methods for Destructive Shear Testing of Ball Bonds", American Society for Testing and Materials, 100 Barr Harbor Drive, West Conshohocken, PA., 1995
4. ASTM Standard F459-84, "Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds", American Society for Testing and Materials, 100 Barr Harbor Drive, West Conshohocken, PA., 1995