Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

Materials Letters

Volumn 162, Issue , 2016, Pages 250-253

  Boccaccini, D N ^a   Sevecek, O ^b   Frandsen, H L ^a   Dlouhy, I ^c   Molin, S ^a   Cannio, M ^d   Hjelm, J ^a   Hendriksen, P V ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b BRNO UNIVERSITY OF TECHNOLOGY   (Czech Republic)

^c INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

^d UNIVERSITY OF MODENA AND REGGIO EMILIA   (Italy)

Author keywords

Metal ceramic bond strength; Schwickerath crack initiation test; SOC interfaces; Three point bending test

Indexed keywords

CERAMIC MATERIALS; CRACK INITIATION; CRACKS; DIFFUSION BONDING; ELECTRODES; INTEGRATED CIRCUIT INTERCONNECTS; STEAM TURBINES;

BONDING MECHANISM; BONDING STRENGTH; ELECTRODE INTERFACE; MECHANICAL CHARACTERIZATIONS; METAL INTERCONNECTS; METAL-CERAMIC BONDS; SOLID-OXIDE CELLS; THREE-POINT BENDING TEST;

SOLID OXIDE FUEL CELLS (SOFC);

EID: 84945263479     PISSN: 0167577X     EISSN: 18734979     Source Type: Journal    
DOI: 10.1016/j.matlet.2015.07.137     Document Type: Article

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