A surface integral equation method for solving complicated electrically small structures

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 341-344

  Yunhui, Chu ^a   Weng, Cho Chew ^a  

^a United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MATRIX ALGEBRA;

COMPUTATIONAL COSTS; CONTACT REGIONS; INTERCONNECT ANALYSIS; MATRIX EQUATIONS; SURFACE INTEGRAL EQUATION METHODS; SURFACE INTEGRAL EQUATIONS;

INTEGRAL EQUATIONS;

EID: 84945258028     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250064     Document Type: Conference Paper

References (4)

1. S. Y. Chen, J. S. Zhao, and W. C. Chew, "Analyzing low-frequency electromagnetic scattering from a composite object", IEEE Trans, Geosci. Remote Sensing, Vol. 40, No. 2, pp. 426-433, Feb. 2002.
2. Y. Chu, W. C. Chew, J. S. Zhao, and S - Y. Chen, "A surface integral equation formulation for low-frequency scattering from a composite object"1, IEEE Trans. Antennae Propagate accepted for publication.
3. J. S. Zhao and W. C. Chew, "Integral equation solution of Maxwell's equations from zero frequency to microwave frequencies", IEEE Trans. Antennas Propagat Vol. 48, pp. 1635-1645, Oct. 2000.
4. Y. Chu and W. C. Chew, "A Multi-Level Fast Multipole Algorithm for Low-Frequency Scattering torn a. Composite Object", IEEE Antenna Propagat. Soc. Int. Symp. Dig., Vol 1, pp. 43-46, 2003.