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Volumn 67, Issue , 2015, Pages 194-202

Failure Modes Identified during Adhesion Testing of Metal Fingers on Silicon Solar Cells

Author keywords

Adhesion; Failure modes; Metal fingers; Metallisation; Silicon solar cells

Indexed keywords

ADHESION; FAILURE MODES; METALLIZING; METALS; SEMICONDUCTOR MATERIALS;

EID: 84943593050     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2015.02.087     Document Type: Conference Paper
Times cited : (13)

References (10)
  • 1
    • 0000525769 scopus 로고
    • Measurement of the adhesion of thin films
    • R. Jacobsson Measurement of the adhesion of thin films Thin Solid Films 34 1976 191 199
    • (1976) Thin Solid Films , vol.34 , pp. 191-199
    • Jacobsson, R.1
  • 3
    • 84879623347 scopus 로고    scopus 로고
    • Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells
    • Mondon A, Jawaid MN, Bartsch J, Glatthaar M, Glunz SW. Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells. Solar Energy Materials and Solar Cells, vol. 117, pp. 209-213, 2013.
    • (2013) Solar Energy Materials and Solar Cells , vol.117 , pp. 209-213
    • Mondon, A.1    Jawaid, M.N.2    Bartsch, J.3    Glatthaar, M.4    Glunz, S.W.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.