Coupled modeling of time-dependent full-chip heating and quantum non-isothermal device operation

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn 2003-January, Issue , 2003, Pages 311-314

  Akturk, A ^a   Goldsman, N ^a   Metze, G ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b LABORATORY FOR PHYSICAL SCIENCES   (United States)

Author keywords

Charge carrier processes; Differential equations; Heat engines; Integral equations; Lattices; Poisson equations; Resistance heating; Temperature; Thermal conductivity; Thermal resistance

Indexed keywords

CRYSTAL LATTICES; DIFFERENTIAL EQUATIONS; HEAT ENGINES; HEAT RESISTANCE; INTEGRAL EQUATIONS; POISSON EQUATION; SEMICONDUCTOR DEVICES; TEMPERATURE; THERMOANALYSIS;

CHARGE CARRIER PROCESS; CHIP TEMPERATURE; COUPLED MODELING; DEVICE OPERATIONS; DISTRIBUTED DEVICES; FULL-CHIP HEATING; KELVIN TEMPERATURES; RESISTANCE-HEATING;

THERMAL CONDUCTIVITY;

EID: 84943231641     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SISPAD.2003.1233699     Document Type: Conference Paper

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