An experimental study of liquid jet impingement cooling of electronic components with and without boiling

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 369-375

  Cheng, Yang ^a   Tay, A A O ^a   Hong, Xue ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CALIFORNIA STATE POLYTECHNIC UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONIC COOLING; FIGHTER AIRCRAFT; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; JETS; MODIFIED ATMOSPHERE PACKAGING; NETWORK COMPONENTS; NUCLEATION; PACKAGING MATERIALS; PROBABILITY DISTRIBUTIONS; THICK FILMS; VELOCITY;

BOILING HEAT TRANSFER; CRITICAL HEAT FLUX(CHF); ELECTRONIC COMPONENT; LIQUID JET IMPINGEMENT; SINGLE PHASE HEAT TRANSFERS; SPONTANEOUS NUCLEATION; SURFACE CONDITIONS; THICK FILM RESISTORS;

HEAT TRANSFER;

EID: 84940996944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984012     Document Type: Conference Paper

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