The future of IC design innovation

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 58, Issue , 2015, Pages 16-21

  Sutardja, Sehat ^a  

^a MARVELL SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CURRICULA; DYNAMIC RANDOM ACCESS STORAGE; ENGINEERS; INTEGRATED CIRCUITS; TIMING CIRCUITS;

CHIP-TO-CHIP INTERCONNECT; DESIGN AND IMPLEMENTATIONS; DESIGN INNOVATIONS; DESIGNING COMPLEX; FINANCIAL OPTIMIZATIONS; LOGICAL FUNCTIONS; SOPHISTICATED SYSTEM; WIRELESS COMMUNICATION DEVICES;

INTEGRATED CIRCUIT DESIGN;

EID: 84940779236     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2015.7062847     Document Type: Conference Paper

References (0)