Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system

Journal of Intelligent and Fuzzy Systems

Volumn 28, Issue 6, 2015, Pages 2771-2784

  Tsai, Tsung Nan ^a   Yeh, Jun Hsien ^b  

^a SHU TE UNIVERSITY   (Taiwan)

^b CHENG SHIU UNIVERSITY   (Taiwan)

Author keywords

FMEA; fuzzy inference system; grey relational analysis; Printed circuit assembly; surface mount assembly

Indexed keywords

ASSEMBLY; FAILURE (MECHANICAL); FUZZY INFERENCE; FUZZY SYSTEMS; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; QUALITY CONTROL; SOLDERING; SURFACE MOUNT TECHNOLOGY;

FMEA; FUZZY INFERENCE SYSTEMS; GREY RELATIONAL ANALYSIS; PRINTED CIRCUIT ASSEMBLIES; SURFACE MOUNT ASSEMBLY;

RISK ASSESSMENT;

EID: 84940043489     PISSN: 10641246     EISSN: 18758967     Source Type: Journal    
DOI: 10.3233/IFS-151556     Document Type: Article

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