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Volumn 1803, Issue , 1993, Pages 235-247
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Introduction of a new High Density Plasma reactor concept for high aspect ratio oxide etching
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Author keywords
[No Author keywords available]
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Indexed keywords
ANISOTROPY;
ELECTROMAGNETIC INDUCTION;
ETCHING;
PLASMA APPLICATIONS;
STICTION;
SUPPORTS;
DEVICE DEGRADATION;
DEVICE TECHNOLOGIES;
HIGH ASPECT RATIO;
HIGH ASPECT RATIO STRUCTURES;
HIGH DENSITY PLASMAS;
HIGH SELECTIVITY;
INDUCTIVELY-COUPLED;
SUBSTRATE MATERIAL;
ASPECT RATIO;
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EID: 84939719458
PISSN: 0277786X
EISSN: 1996756X
Source Type: Conference Proceeding
DOI: 10.1117/12.142920 Document Type: Conference Paper |
Times cited : (7)
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References (8)
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