Nanofluids for electronics cooling

2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging, SIITME 2014

Volumn , Issue , 2014, Pages 35-37

  Turgut, Alpaslan ^a   Elbasan, Emre ^a  

^a DOKUZ EYLUL UNIVERSITY   (Turkey)

Author keywords

central processing unit (CPU); electronics cooling; nanofluids; nanoparticles

Indexed keywords

ALUMINA; ALUMINUM OXIDE; ELECTRONICS PACKAGING; HEAT RESISTANCE; NANOFLUIDICS; NANOPARTICLES; PROGRAM PROCESSORS; TEMPERATURE MEASUREMENT; THERMOCOUPLES;

ALUMINA PARTICLES; ELECTRONICS COOLING; K-TYPE THERMOCOUPLES; MAXIMUM TEMPERATURE; NANOFLUIDS; PARTICLE CONCENTRATIONS; THERMAL PERFORMANCE; VOLUME CONCENTRATION;

ELECTRONIC COOLING;

EID: 84936060290     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SIITME.2014.6966989     Document Type: Conference Paper

References (10)

1. A. L. Moore and S. Li, "Emerging challenges and materials for thermal management of electronics", Materials Today, Vol. 17, No. 4, pp. 163-174, May, 2014.
2. S.U.S. Choi, "Enhancing thermal conductivity of fluids with nanoparticles", Developments and applications of non-newtonian flows, FED-Vol. 231, pp. 99-105, ASME, 1995.
3. I.M. Mahbubul, R. Saidur, A.M. Amalina, "Thermal conductivity, viscosity and density of R141b refrigerant based nanofluid", Procedia Eng., Vol. 56, pp. 310-315, 2013.
4. S.S Chougule, S.K. Sahu, "Comparative study of cooling performance of automobile radiator using Al2O3-water and carbon nanotube-water nanofluid", J. Nanotechnol. Eng. Med., Vol. 5, pp. 011001-6, March 2014.
5. Goudarzi, K., Shojaeizadeh, E., Nejati, F., An experimental investigation on the simultaneous effect of CuO-H2O nanofluid and receiver helical pipe on the thermal efficiency of a cylindrical solar collector, Appl. Therm. Eng., Vol. 73, pp. 1234-1241, December 2014.
6. Ho, C. J., Chen, W. C., An experimental study on thermal performance of Al2O3/water nanofluid in a minichannel heat sink, Appl. Therm. Eng., Vol. 50, pp. 516-522, January 2013.
7. A. A. Mohammed, N. Mohd-Ghazali, R. Ahmad, "Thermal and hydrodynamic analysis of microchannel heat sinks: A review". Renew. Sust. Energ. Rev., Vol. 21, pp. 614-622, May 2013.
8. C.T. Nguyen, G. Roy, C. Gauthier, N. Galanis, "Heat transfer enhancement using Al2O3-water nanofluid for an electronic liquid cooling system", Appl. Therm. Eng., Vol. 27, pp. 1501-1506, June 2007.
9. N.A. Roberts, D.G. Walker, "Convective performance of nanofluids in commercial electronics cooling systems", Appl. Therm. Eng., Vol. 30, pp. 2499-2504, November 2010.
10. M. Nazari, M. Karami, and M. Ashouri, "Comparing the thermal performance of water, Ethylene Glycol, Alumina and CNT nanofluids in CPU cooling: Experimental study", Exp. Therm. Fluid Sci., Vol. 57, pp. 371-377, September, 2014.