Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding

2007 33rd European Conference and Exhibition of Optical Communication, ECOC 2007

Volumn , Issue , 2007, Pages

  Heidrich, H ^a   Hamacher, M ^a   Troppenz, U ^a   Syvridis, D ^b   Alexandropoulos, D ^b   Mikroulis, S ^b   Tee, C W ^c   Williams, K ^c   Dragoi, V ^d   Alexe, M ^e   Cristea, D ^f   Kusko, C ^f   Kusko, M ^f  

^a FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

^b UNIVERSITY OF ATHENS   (Greece)

^c UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^d EV GROUP   (Austria)

^e MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^f NATIONAL INSTITUTE FOR RESEARCH AND DEVELOPMENT IN MICROTECHNOLOGIES   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FABRICATION; GALLIUM COMPOUNDS; INDIUM COMPOUNDS; OPTICAL COMMUNICATION;

ACTIVE/PASSIVE; GAINASP; MICRO-RING LASERS; WAVEGUIDE COUPLING;

WAFER BONDING;

EID: 84931058636     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ic:20070227     Document Type: Conference Paper

References (4)

1. P.P. Absil et al., IEEE Phot. TEchnol. Lett., Vol. 13, no. 1 (2001), pp. 49-51
2. K. Amarnath et al., IEEE Phot. Technol. Lett., Vol. 17 (2005), pp. 2280-2282
3. M. Kusko et al., Proc. SPIE Vol. 5956, 59561E, Integrated Optics: Theory and Applications (Sept. 2005)
4. C.w. Tee et al., IEEE J. STQE, Vol. 12, no. 1 (2006), pp. 108-116