Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components

Applied Thermal Engineering

Volumn 87, Issue , 2015, Pages 454-462

  Gharbi, Salma ^a   Harmand, Souad ^b   Jabrallah, Sadok Ben ^a  

^a UNIVERSITY OF CARTHAGE   (Tunisia)

^b UNIV LILLE   (France)

Author keywords

Cooling electronic components; Fins; Heat sink; Phase change material; Porous matrix

Indexed keywords

COOLING; COPPER; FINS (HEAT EXCHANGE); GRAPHITE; HEAT SINKS; HEAT TRANSFER; PHASE CHANGE MATERIALS; PHASE INTERFACES; SILICONES; THERMAL VARIABLES CONTROL; THERMOELECTRIC EQUIPMENT;

COMPONENT TEMPERATURES; COOLING ELECTRONIC COMPONENTS; EXPERIMENTAL COMPARISON; FINS; POROUS MATRIXS; SOLID-LIQUID INTERFACES; TEMPERATURE EVOLUTION; THERMO-PHYSICAL PROPERTY;

ELECTRONIC COOLING;

EID: 84930650870     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2015.05.024     Document Type: Article

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