Electronic cooling using thermoelectric devices

Applied Physics Letters

Volumn 106, Issue 20, 2015, Pages

  Zebarjadi, M ^a,b  

^a RUTGERS UNIVERSITY   (United States)

^b RUTGERS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COOLING SYSTEMS; COPPER; ELECTRIC POWER FACTOR; HEAT FLUX; THERMAL CONDUCTIVITY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

COOLING SOLUTIONS; COPPER HEAT SINK; PASSIVE COOLING; PELTIER COOLERS; THERMO-ELECTRIC MATERIALS; THERMOELECTRIC COOLER; THERMOELECTRIC DEVICES; THERMOELECTRIC ELEMENT;

ELECTRONIC COOLING;

EID: 84930225063     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4921457     Document Type: Article

References (20)

1. A. F. Ioffe, Semiconductor Thermoelements, and Thermoelectric Cooling (Infosearch, ltd., 1957).
2. D. Vashaee, J. Christofferson, Y. Zhang, A. Shakouri, G. Zeng, C. LaBounty, X. Fan, J. Piprek, J. E. Bowers, and E. Croke, " Modelling and optimization of single-element bulk SiGe thin-film coolers," Microscale Thermophys. Eng. 9, 99-118 (2005). 10.1080/10893950590913459
3. W. Seifert, V. Pluschke, and N. F. Hinsche, " Thermoelectric cooler concepts and the limit for maximum cooling," J. Phys. Condens. Matter 26, 255803 (2014). 10.1088/0953-8984/26/25/255803
4. A. Shakouri, " Nanoscale thermal transport and microrefrigerators on a chip," Proc. IEEE 94, 1613-1638 (2006). 10.1109/JPROC.2006.879787
5. J.-P. Fleurial, A. Borshchevsky, M. A. Ryan, W. Phillips, E. Kolawa, T. Kacisch, and R. Ewell, " Thermoelectric microcoolers for thermal management applications," in XVI Proceedings of the 16th International Conference on Thermoelectrics (Cat. No. 97TH8291) (IEEE, 1997), pp. 641-645. 10.1109/ICT.1997.667611
6. R. Singh, D. Vashaee, Y. Zhang, M. Negassi, A. Shakouri, Y. Okuno, G. Zeng, C. LaBounty, and J. Bowers, " Experimental characterization and modeling of InP-based microcoolers," MRS Proc. 793, S11.4.1 (2003). 10.1557/PROC-793-S11.4
7. H. J. Goldsmid, " Recent trends in thermoelectric materials research," In Semiconductors and Semimetals, edited by T. Tritt (Academic Press, San Diego, 2001), Vol. 69, pp. 1-24.
8. M. Manno, B. Yang, and A. Bar-Cohen, " Thermoelectric coolers-Active thermal control modules," Annu. Rev. Heat Transfer (in press).
9. I. Chowdhury, R. Prasher, K. Lofgreen, G. Chrysler, S. Narasimhan, R. Mahajan, D. Koester, R. Alley, and R. Venkatasubramanian, " On-chip cooling by superlattice-based thin-film thermoelectrics," Nat. Nanotechnol. 4, 235-238 (2009). 10.1038/nnano.2008.417
10. G. S. Nolas, J. Sharp, and H. J. Goldsmid, Thermoelectrics: Basic Principles and New Materials Developments (Springer, 2001).
11. H. J. Goldsmid, Introduction to Thermoelectricity (Springer, Berlin Heidelberg, 2010), Vol. 121.
12. T. L. Bergman, A. S. Lavine, F. P. Incropera, and D. P. DeWitt, Introduction to Heat Transfer, 6th edn. (John Wiley and Sons, Inc., Hoboken, NJ, 2011.
13. See supplemental material at http://dx.doi.org/10.1063/1.4921457 E-APPLAB-106-023521 for detailed derivations.
14. G. Chen and A. Shakouri, " Heat transfer in nanostructures for solid-state energy conversion," J. Heat Transfer 124, 242 (2002). 10.1115/1.1448331
15. L. E. Bell, " Cooling, heating, generating power, and recovering waste heat with thermoelectric systems," Science 321, 1457-1461 (2008). 10.1126/science.1158899
16. A. Burkov and M. Vedernikov, " Thermoelectric properties of metallic materials," In CRC Handbook of Thermoelectrics, edited by D. M. Rowe (CRC Press, Boca Raton, 1995).
17. D. Yarbrough, R. Williams, and R. Graves, " Transport properties of concentrated Ag-Pd and Cu-Ni alloys from 300-1000 K," Therm. Conduct. 16, 319 (1983). 10.1007/978-1-4684-4265-6-28
18. G. Mahan, " Good thermoelectrics," Solid State Phys. 51, 81 (1997). 10.1016/S0081-1947(08)60190-3
19. G. Zhu, H. Lee, Y. Lan, X. Wang, G. Joshi, D. Wang, J. Yang, D. Vashaee, H. Guilbert, A. Pillitteri et al., " Increased phonon scattering by nanograins and point defects in nanostructured silicon with a low concentration of germanium," Phys. Rev. Lett. 102, 196803 (2009). 10.1103/PhysRevLett.102.196803
20. P. H. Jiang, H. J. Liu, D. D. Fan, L. Cheng, J. Wei, J. Zhang, J. H. Liang, and J. Shi, " Enhanced thermoelectric performance of carbon nanotubes at elevated temperature," e-print arXiv:1502.01449.