Use of the Three-Dimensional TLM Method in the Thermal Simulation and Design of Semiconductor Devices

IEEE Transactions on Electron Devices

Volumn 39, Issue 6, 1992, Pages 1295-1302

  Webb, Paul W ^b   Gao, Guang Bo ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84930092863     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.137307     Document Type: Article

References (21)

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