EUROSERVER: Energy efficient node for European micro-servers

Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014

Volumn , Issue , 2014, Pages 206-213

  Durand, Yves ^a   Carpenter, Paul M ^b   Adami, Stefano ^c   Bilas, Angelos ^d   Dutoit, Denis ^a   Farcy, Alexis ^e   Gaydadjiev, Georgi ^f   Goodacre, John ^g   Katevenis, Manolis ^d   Marazakis, Manolis ^d   Matus, Emil ^h   Mavroidis, Iakovos ^d   Thomson, John ⁱ  

^a UNIV GRENOBLE ALPES   (France)

^b BARCELONA SUPERCOMPUTING CENTER   (Spain)

^c Eurotech Spa   (Italy)

^d INSTITUTE OF COMPUTER SCIENCE   (Greece)

^e STMICROELECTRONICS   (France)

^f CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^g ARM LTD   (United Kingdom)

^h DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

ⁱ OnApp   (United Kingdom)

Author keywords

ARM; FD SOI; System architecture; Three dimensional (3D) integrated circuits; Virtualization

Indexed keywords

APPLICATION PROGRAMS; ARM PROCESSORS; COMPUTER ARCHITECTURE; EMBEDDED SYSTEMS; ENERGY EFFICIENCY; FINITE DIFFERENCE METHOD; GREEN COMPUTING; VIRTUALIZATION;

COLLABORATIVE PROJECTS; FD-SOI; FULLY DEPLETED SILICON ON INSULATORS (FD SOI); PROCESS TECHNOLOGIES; SOFTWARE TECHNIQUES; SYSTEM ARCHITECTURES; TELECOM INFRASTRUCTURES; THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS;

SILICON ON INSULATOR TECHNOLOGY;

EID: 84928801523     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DSD.2014.15     Document Type: Conference Paper

References (13)

1. ARM Annual Report, 2012.
2. R. Chaware, K. Nagarajan, S. Ramal, "Assembly and Reliability Challenges in 3D Integration of 28nm FPGA Die on a Large High Density 65nm Passive Interposer", in Reliability Physics Symposium (IRPS), 15-19 April 2012, p. 279-283.
3. China Mobile Research Institute, C-RAN, The Road Towards Green RAN, White Paper, 2010.
4. Energy-conscious 3D Server-on-Chip for Green Cloud ("EuroCloud"). http://www.eurocloudserver.com.
5. EUROSERVER project website: www.euroserver-project.eu.
6. IDC-Digital Universe Study, sponsored by EMC, December 2012.
7. J. Goodacre, Technology Preview: The ARMv8 Architecture, November 2011.
8. J. Koomey for Analytics Press, Aug 2011.
9. N. Rajovic et al. "Supercomputing with commodity CPUs: Are mobile SoCs ready for HPC." Proceedings of SC13: International Conference for High Performance Computing, Networking, Storage and Analysis. ACM, 2013.
10. Talent Neuron Research and Analysis, 2013.
11. E. Tejedor and R. M. Badia. COMP Superscalar: Bringing GRID superscalar and GCM Together. In 8th IEEE International Symposium on Cluster Computing and the Grid, May 2008.
12. Tilera S2Q X5 Multi-node Series, http://www.tilera.com/sites/default/ files/productbriefs/S2Q-server-overview.pdf
13. TOP500, www.top500.org.