Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density

Journal of Electronic Materials

Volumn 43, Issue 12, 2014, Pages 4510-4514

  Caccuri, V ^a   Milhet, X ^a   Gadaud, P ^a   Bertheau, D ^a   Gerland, M ^a  

^a UNIVERSITÉ DE POITIERS   (France)

Author keywords

density; mechanical properties; microstructure; Silver paste; sintering

Indexed keywords

LEAD ALLOYS; MECHANICAL PROPERTIES; MICROSTRUCTURE; POROSITY; SINTERING; TENSILE TESTING; YIELD STRESS;

BULK SPECIMENS; DIE BONDING; ELECTRONIC SYSTEMS; RESIDUAL POROSITY; ROBUST PROCEDURES; SILVER PASTES; SILVER POWDERS; ULTIMATE TENSILE STRESS;

DENSITY (SPECIFIC GRAVITY);

EID: 84925501168     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/s11664-014-3458-x     Document Type: Article

References (6)

1. G. Bai (Ph.D. thesis, Virginia Polytechnic Institute and State University, Blackburgh, VA, 2005).
2. X. Chen, R. Li, K. Qi, and G. Lu, J. Electron. Mater. 37, 1574 (2008).
3. X. Li, G. Chen, L. Wang, Y.H. Mei, X. Chen, and G. Lu, Mater. Sci. Eng. A 579, 108 (2013).
4. X. Li, G. Chen, G. Lu, L. Wang, and Y.H. Mei, Microelectron. Reliab. 53, 174 (2013).
5. T. Wang, G. Chen, Y. Wang, X. Chen, and Q. Lu, Mater. Sci. Eng. A 527, 6714 (2010).
6. V. Caccuri (Ph.D. thesis, ENSMA, France, 2014).