Soft network composite materials with deterministic and bio-inspired designs

Nature Communications

Volumn 6, Issue , 2015, Pages

  Jang, Kyung In ^a   Chung, Ha Uk ^a   Xu, Sheng ^a   Lee, Chi Hwan ^a   Luan, Haiwen ^b   Jeong, Jaewoong ^c   Cheng, Huanyu ^b   Kim, Gwang Tae ^a   Han, Sang Youn ^a,d   Lee, Jung Woo ^a,e   Kim, Jeonghyun ^a,e   Cho, Moongee ^a   Miao, Fuxing ^b,f   Yang, Yiyuan ^a   Jung, Han Na ^a   Flavin, Matthew ^a   Liu, Howard ^a   Kong, Gil Woo ^a   Yu, Ki Jun ^a   Rhee, Sang Il ^a   Chung, Jeahoon ^a   Kim, Byunggik ^a   Kwak, Jean Won ^a   Yun, Myoung Hee ^a,g   Kim, Jin Young ^g   Song, Young Min ^h   Paik, Ungyu ^e   Zhang, Yihui ^b,i   Huang, Yonggang ^b   Rogers, John A ^a   more..

^a University of Illinois at Urbana Champaign   (United States)

^b Northwestern University   (United States)

^c UCB 450   (United States)

^d Samsung Display Co   (South Korea)

^e Department of Material Science and Engineering Department of Energy Engineering ^*  (South Korea)

^f NINGBO UNIVERSITY   (China)

^g Ulsan National Institute of Science and Technology   (South Korea)

^h Pusan National University   (South Korea)

ⁱ TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOMER; POLYIMIDE; SILASTIC; BIOMATERIAL; BIOMIMETIC MATERIAL; HYDROGEL; IMIDE;

BIOMECHANICS; COMPOSITE; DESIGN; DRUG; ELECTROCHEMICAL METHOD; SENSOR; SKIN; STRESS-STRAIN RELATIONSHIP;

ARTICLE; BIOINSPIRED HARD COMPOSITE MATERIAL; BIOINSPIRED SOFT COMPOSITE MATERIAL; COMPOSITE MATERIAL; DRUG RELEASE; ELECTRONICS; EQUIPMENT DESIGN; HYDROGEL; TENSILE STRENGTH; THICKNESS; TISSUE ENGINEERING; BIOMIMETICS; CHEMISTRY; DRUG DELIVERY SYSTEM; ELECTROPHYSIOLOGY; EPIDERMIS; FINITE ELEMENT ANALYSIS; HARDNESS; HUMAN; MATERIALS TESTING; MECHANICAL STRESS; METABOLISM; PROCEDURES; SKIN; YOUNG MODULUS;

BIOCOMPATIBLE MATERIALS; BIOMIMETIC MATERIALS; BIOMIMETICS; DRUG DELIVERY SYSTEMS; ELASTIC MODULUS; ELECTRONICS; ELECTROPHYSIOLOGY; EPIDERMIS; FINITE ELEMENT ANALYSIS; HARDNESS; HUMANS; HYDROGELS; IMIDES; MATERIALS TESTING; SKIN; STRESS, MECHANICAL; TENSILE STRENGTH; TISSUE ENGINEERING;

EID: 84925067717     PISSN: None     EISSN: 20411723     Source Type: Journal    
DOI: 10.1038/ncomms7566     Document Type: Article

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