Handbook of 3D Integration

Handbook of 3D Integration

Volumn 3, Issue , 2014, Pages 1-451

  Garrou, Philip ^a   Koyanagi, Mitsumasa ^b   Ramm, Peter ^c  

^a Microelectronic Consultants of North Carolina   (United States)

^b TOHOKU UNIVERSITY   (Japan)

^c Fraunhofer Institut fur Festkorpertechnologie   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEBONDING; SEMICONDUCTOR DEVICE MANUFACTURE;

3-D INTEGRATION; EMERGING TECHNOLOGIES; HIGH TECH COMPANIES; INTEGRATED DEVICE; KEY FIGURES; MATERIALS SCIENTIST; RESEARCH INSTITUTIONS; SEMICONDUCTOR INDUSTRY;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84922177375     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527670109     Document Type: Book

References (0)