Bonding piezoelectric wafers for application in structural health monitoring-adhesive selection

Research in Nondestructive Evaluation

Volumn 26, Issue 1, 2015, Pages 23-42

  Mustapha, Samir ^a,b   Ye, Lin ^c  

^a CSIRO   (Australia)

^b AMERICAN UNIVERSITY OF BEIRUT   (Lebanon)

^c UNIVERSITY OF SYDNEY   (Australia)

Author keywords

adhesives; guided waves; piezoelectric wafers; structural health monitoring

Indexed keywords

ADHESIVES; GUIDED ELECTROMAGNETIC WAVE PROPAGATION; PIEZOELECTRICITY; SHEAR FLOW; SURFACE WAVES; WAFER BONDING;

ADHESIVE SYSTEMS; BONDLINE THICKNESS; PIEZOELECTRIC WAFERS; PROPAGATION VELOCITIES; ROOM TEMPERATURE; SIGNAL MAGNITUDE; STRUCTURAL HEALTH MONITORING (SHM); TRANSMITTED WAVES;

STRUCTURAL HEALTH MONITORING;

EID: 84921991274     PISSN: 09349847     EISSN: 14322110     Source Type: Journal    
DOI: 10.1080/09349847.2014.934575     Document Type: Article

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