Carbon nanotube based 3-D interconnects - A reality or a distant dream

IEEE Circuits and Systems Magazine

Volumn 14, Issue 4, 2014, Pages 16-35

  Kaushik, Brajesh Kumar ^a   Majumder, Manoj Kumar ^a   Kumar, Vobulapuram Ramesh ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

Carbon nanotube; Conductivity; Fabrication; Integrated circuits; Scattering; Thermal stability; Three dimensional displays

Indexed keywords

CARBON; CARBON NANOTUBES; CMOS INTEGRATED CIRCUITS; ELECTRIC CONDUCTIVITY; FABRICATION; FILLERS; GRAIN BOUNDARIES; GROWTH (MATERIALS); INTEGRATED CIRCUITS; SCATTERING; SURFACE SCATTERING; THERMODYNAMIC STABILITY; THREE DIMENSIONAL INTEGRATED CIRCUITS; YARN;

3-D INTERCONNECTS; CHOICE OF FILLER MATERIALS; CURRENT CARRYING CAPABILITY; GRAIN BOUNDARY SCATTERING; INTEGRATED SYSTEMS; PROPAGATION DELAYS; TEMPERATURE-SENSITIVE MATERIALS; THREE-DIMENSIONAL DISPLAY;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84914814155     PISSN: 1531636X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MCAS.2014.2360787     Document Type: Review

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