In-process monitoring of contact zone forces during rotational grinding of silicon wafers

Proceedings of the 6th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2006

Volumn 2, Issue , 2006, Pages 68-71

  Pahler D ^a   Klocke, F ^a   Beegen, L ^a   Herben, M ^a   Jakob, A ^a  

^a FRAUNHOFER INSTITUTE FOR PRODUCTION TECHNOLOGY IPT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GRINDING (MACHINING); PRECISION ENGINEERING; PROCESS MONITORING; SILICON; WHEELS;

CONTACT ZONE FORCE; FORCE COMPONENT; IN-PROCESS MONITORING; PIEZOELECTRIC FORCE SENSORS; RADIAL DIRECTION; RADIAL FORCES; TANGENTIAL FORCE; THREE-COMPONENT;

SILICON WAFERS;

EID: 84908338957     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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